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Proceedings of ASME 2022 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : (InterPACK2022) : October 25-27, 2022 : Garden Grove, California : InterPACK : Oct 2022, Garden Grove, CA.

Proceedings of ASME 2022 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : (InterPACK2022) : October 25-27, 2022 : Garden Grove, California : InterPACK : Oct 2022, Garden Grove, CA.
紙図書
The American Society of Mechanical Engineers (ASME)[2022]<M17-23-256>
国立国会図書館
  • 著者標目American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.

Proceedings of ASME 2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : (InterPACK2021) : October 26-28, 2021 : virtual, online : InterPACK : artificial intelligence workshop : Oct 2021, ------.

Proceedings of ASME 2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : (InterPACK2021) : October 26-28, 2021 : virtual, online : InterPACK : artificial intelligence workshop : Oct 2021, ------.
紙図書
The American Society of Mechanical Engineers (ASME)[2021]<M17-22-575>
国立国会図書館
  • 著者標目...2021 : Online) American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.

Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS--2011 : presented at ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS : July 6-8, 2011, Portland, Oregon, USA v. 1 : pbk. v. 2 : pbk.

Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS--2011 : presented at ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS, and NEMS : July 6-8, 2011, Portland, Oregon, USA v. 1 : pbk. v. 2 : pbk.
紙図書
ASMEc2012
全国の図書館

Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASMEAmerican Society of Mechanical Engineersc2007
全国の図書館

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems - 2005 : presented at the 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orland, Florida USA

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems - 2005 : presented at the 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orland, Florida USA
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASMEAmerican Society of Mechanical Engineersc2005
全国の図書館

Electronic and photonic packaging, electrical systems design and photonics, and nanotechnology : presented at the 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California USA

Electronic and photonic packaging, electrical systems design and photonics, and nanotechnology : presented at the 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California USA
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASMEAmerican Society of Mechanical Engineersc2004
全国の図書館

Advances in electronic packaging 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii : set

Advances in electronic packaging 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii : set
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASMEAmerican Society of Mechanical Engineersc2003
全国の図書館

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]American Society of Mechanical Engineersc2003
全国の図書館

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