sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) Society, Packaging Research Center at Georgia Tech(GT-PRC) ; technical sponsor, Fraunhofer IZM ; general chair, Petri Savolainen ; general chair elect, Jianmin Qu ; technical chair, Petri Savolainen ; technical chair elect, Suresh SitaramanIEEE Service Centerc2004
全国の図書館
- 件名Electronic packaging -- Materials Congresses
- 件名(識別子)Electronic packaging -- Materials Congresses
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) , Packaging Research Center at Georgia Tech(USA) ; technical sponsors, Fraunhofer IZM(Germany), Material Research Society ; general chair, Rajen Chanchan ; general chair elect, Andras Schubert ; technical chair, Jianmin Qu ; technical chair elect, Petri SavolainenIEEE Service Centerc2002
全国の図書館
- 件名Electronic packaging -- Materials Congresses
- 件名(識別子)Electronic packaging -- Materials Congresses
co-sponsored by : International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packing, and Manufacturing Technology (CPMT), Georgia Institute of Technology, Packaging Research Center (PRC) ; general chair, James E. Morris ; technical chairs, Andreas SchubertIMAPS[2001]
全国の図書館
- 件名Electronic packaging -- Materials Congresses
- 件名(識別子)Electronic packaging -- Materials Congresses
co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.] ; technical chairs, Philip Garrou, James E. MorrisIMAPS[2000]
全国の図書館
- 件名Electronic packaging -- Materials Congresses
- 件名(識別子)Electronic packaging -- Materials Congresses
co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.] ; technical chairs, Philip Garrou, James E. MorrisIMAPS[1999]
全国の図書館
- 件名Electronic packaging -- Materials Congresses
- 件名(識別子)Electronic packaging -- Materials Congresses
conference chair, Jorma Kivilahti ; proceedings editor, Marika Hyytiäinen ; sponsored by NOKIA ... [et al.]IEEEc2000
全国の図書館
- 件名...ing Congresses Electronic packaging -- Materials Congresses Adhesive joints Congresses Co...
- 件名(識別子)...ing Congresses Electronic packaging -- Materials Congresses Adhesive joints Congresses Co...
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim SuhirThe American Society of Mechanical Engineersc1998
全国の図書館
- 件名...ity Congresses Electronic packaging -- Materials Congresses Polymeric composites -- Testi...
- 件名(識別子)...ity Congresses Electronic packaging -- Materials Congresses Polymeric composites -- Testi...