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検索結果 91 件

2016 11th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2016) : Taipei, Taiwan : 26-28 October 2016 : IMPACT--IAAC 2016 : IMPACT-IAAC 2016 joint conference : IMPACT2016 : Oct 2016, Taipei, Taiwan.

2016 11th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2016) : Taipei, Taiwan : 26-28 October 2016 : IMPACT--IAAC 2016 : IMPACT-IAAC 2016 joint conference : IMPACT2016 : Oct 2016, Taipei, Taiwan.
紙図書
IEEE[2016]<M17-18-960>
国立国会図書館
  • 件名...s--Congresses. Microelectronic packaging--Congresses. Microelectromechanical system...

2015 10th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2015) : Taipei, Taiwan : 21-23 October 2015 : Oct 2015, Taipei, Taiwan.

2015 10th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2015) : Taipei, Taiwan : 21-23 October 2015 : Oct 2015, Taipei, Taiwan.
紙図書
IEEE[2015]<M17-17-1375>
国立国会図書館
  • 件名...s--Congresses. Microelectronic packaging--Congresses. Microelectromechanical system...

2013 8th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2013) : Taipei, Taiwan : 22-25 October 2013 : IMPACT-IAAC 2013 joint conference : IMPACT-IAAC2013 : joint event of IMPACT and IAAC : Oct 2013, Taipei, Taiwan.

2013 8th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2013) : Taipei, Taiwan : 22-25 October 2013 : IMPACT-IAAC 2013 joint conference : IMPACT-IAAC2013 : joint event of IMPACT and IAAC : Oct 2013, Taipei, Taiwan.
紙図書
IEEE[2013]<M17-14-2908>
国立国会図書館
  • 件名Microelectromechanical systems--Congresses. Microelectronic packaging--Congresses.

2014 9th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2014) : Taipei, Taiwan : 22-24 October 2014 : 2014 IMPACT-EMAP joint conference : Oct 2014, Taipei, Taiwan.

2014 9th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2014) : Taipei, Taiwan : 22-24 October 2014 : 2014 IMPACT-EMAP joint conference : Oct 2014, Taipei, Taiwan.
紙図書
IEEE[2014]<M17-16-1766>
国立国会図書館
  • 件名...s--Congresses. Microelectronic packaging--Congresses. Microelectromechanical system...

2012 13th international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2012) : Guilin, Guangxi, China : 13-16 August 2012 : Aug 2012, Guilin, China. CFP12553

2012 13th international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2012) : Guilin, Guangxi, China : 13-16 August 2012 : Aug 2012, Guilin, China. CFP12553
紙図書
IEEEc2012.<M17-13-3145>
国立国会図書館
  • 件名Microelectronic packaging--Congresses. Electronic packaging--Congres...

2012 7th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2012) : Taipei, Taiwan : 24-26 October 2012 : IMPACT 2012 conference event : Oct 2012, Tapei, Taiwan. CFP1259B-ART

2012 7th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2012) : Taipei, Taiwan : 24-26 October 2012 : IMPACT 2012 conference event : Oct 2012, Tapei, Taiwan. CFP1259B-ART
紙図書
IEEEc2012.<M17-13-2813>
国立国会図書館
  • 件名Microelectromechanical systems--Congresses. Microelectronic packaging--Congresses.

2012 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2012) : Taipei, Taiwan : 9-11 December 2012 : Dec 2012, Taipei, Taiwan.

2012 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2012) : Taipei, Taiwan : 9-11 December 2012 : Dec 2012, Taipei, Taiwan.
紙図書
IEEEc2012.<M17-13-3175>
国立国会図書館
  • 件名Electronic packaging--Congresses. Microelectronic packaging--Congresses.

2013 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2013) : Nara, Japan : 12-15 December 2013 : EDAPS2013 : Dec 2013, Nara, Japan.

2013 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2013) : Nara, Japan : 12-15 December 2013 : EDAPS2013 : Dec 2013, Nara, Japan.
紙図書
IEEE[2013]<M17-15-2606>
国立国会図書館
  • 件名...g--Congresses. Microelectronic packaging--Congresses. Electronic packaging. Microel...

2011 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2011) : Hanzhou, China : 12-14 December 2011 : Dec 2011, Hanzhou, China.

2011 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2011) : Hanzhou, China : 12-14 December 2011 : Dec 2011, Hanzhou, China.
紙図書
IEEEc2011.<M17-13-146>
国立国会図書館
  • 件名Electronic packaging--Congresses. Microelectronic packaging--Congresses.

2010 11th international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2010) : Xi'an, China : 16-19 August 2010. : Aug 2010, Xi'an, China.

2010 11th international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2010) : Xi'an, China : 16-19 August 2010. : Aug 2010, Xi'an, China.
紙図書
IEEEc2010.<M17-11-1504>
国立国会図書館

2010 IEEE electrical design of advanced package & systems symposium : (EDAPS 2010) : Singapore : 7-9 December 2010. : Dec 2010, Singapore.

2010 IEEE electrical design of advanced package & systems symposium : (EDAPS 2010) : Singapore : 7-9 December 2010. : Dec 2010, Singapore.
紙図書
IEEEc2010.<M17-11-2878>
国立国会図書館

2010 5th international microsystems packaging assembly and circuits technology conference : (IMPACT 2010) : Taipei, Taiwan : 20-22 October 2010. : international 3D IC forum (SIPO) : IMPACT2010 : Oct 2010, Taipei, Taiwan.

2010 5th international microsystems packaging assembly and circuits technology conference : (IMPACT 2010) : Taipei, Taiwan : 20-22 October 2010. : international 3D IC forum (SIPO) : IMPACT2010 : Oct 2010, Taipei, Taiwan.
紙図書
IEEEc2010.<M17-11-3332>
国立国会図書館

2016 symposium on design, test, integration and packaging of MEMS/MOEMS (DTIP 2016) : Budapest, Hungary : 30 May-2 June 2016 : symposium on design, test, integration & packaging of MEMS and MOEMS : May 2016, Budapest, Hungary.

2016 symposium on design, test, integration and packaging of MEMS/MOEMS (DTIP 2016) : Budapest, Hungary : 30 May-2 June 2016 : symposium on design, test, integration & packaging of MEMS and MOEMS : May 2016, Budapest, Hungary.
紙図書
IEEE[2016]<M17-18-364>
国立国会図書館
  • 件名Microelectronic packaging--Congresses. Microelectromechanical system...

2013 symposium on design, test, integration and packaging of MEMS/MOEMS : (DTIP 2013) : Barcelona, Spain : 16-18 April 2013 : Apr 2013, Barcelona, Spain.

2013 symposium on design, test, integration and packaging of MEMS/MOEMS : (DTIP 2013) : Barcelona, Spain : 16-18 April 2013 : Apr 2013, Barcelona, Spain.
紙図書
IEEEc2013.<M17-14-991>
国立国会図書館
  • 件名Microelectronic packaging--Congresses. Micromachining--Congresses. O...

2009 fourth international conference on embedded and multimedia computing : (EM-Com 2009) : Jeju, Korea : 10-12 December 2009. : UMCC 2009 : 2009 international workshop on ubiquitous multimedia computing and communications : Dec 2009, ------.

2009 fourth international conference on embedded and multimedia computing : (EM-Com 2009) : Jeju, Korea : 10-12 December 2009. : UMCC 2009 : 2009 international workshop on ubiquitous multimedia computing and communications : Dec 2009, ------.
紙図書
IEEEc2009.<M17-10-3094>
国立国会図書館

2009 international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2009) : Beijing, China : 10-13 August 2009. : Aug 2009, Beijing, China.

2009 international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2009) : Beijing, China : 10-13 August 2009. : Aug 2009, Beijing, China.
紙図書
IEEEc2009.<M17-10-3071>
国立国会図書館

2009 IEEE electrical design of advanced packaging & systems symposium : (EDAPS 2009) : Hong Kong : 2-4 December 2009. : Dec 2009, Hong Kong, China.

2009 IEEE electrical design of advanced packaging & systems symposium : (EDAPS 2009) : Hong Kong : 2-4 December 2009. : Dec 2009, Hong Kong, China.
紙図書
IEEEc2009.<M17-10-3085>
国立国会図書館

2009 4th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2009) : Taipei, Taiwan : 21-23 October 2009. : IMPACT2009 : international 3D IC workshop : international microsystems, packaging, assembly and circuit conference : Oct 2009, Taipei, Taiwan.

2009 4th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2009) : Taipei, Taiwan : 21-23 October 2009. : IMPACT2009 : international 3D IC workshop : international microsystems, packaging, assembly and circuit conference : Oct 2009, Taipei, Taiwan.
紙図書
IEEEc2009.<M17-10-4026>
国立国会図書館

2015 symposium on design, test, integration and packaging of MEMS/MOEMS : (DTIP 2015) : Montpellier, France : 27-30 April 2015 : symposium on design, test, integration & packaging of MEMS and MOEMS : Apr 2015, Montpellier, France.

2015 symposium on design, test, integration and packaging of MEMS/MOEMS : (DTIP 2015) : Montpellier, France : 27-30 April 2015 : symposium on design, test, integration & packaging of MEMS and MOEMS : Apr 2015, Montpellier, France.
紙図書
IEEE[2015]<M17-17-647>
国立国会図書館
  • 件名Microelectronic packaging--Congresses. Microelectromechanical system...

Reliability, packaging, testing, and characterization of MOEMS/MEMS and nanodevices 12 : 4-5 February 2013 : San Francisco, California, United States : Feb 2013, San Francisco, CA. (SPIE Proceedings ; 8614)

Reliability, packaging, testing, and characterization of MOEMS/MEMS and nanodevices 12 : 4-5 February 2013 : San Francisco, California, United States : Feb 2013, San Francisco, CA. (SPIE Proceedings ; 8614)
紙図書
SPIEc2013.<M17-13-2959>
国立国会図書館
  • 件名...g--Congresses. Microelectronic packaging--Congresses.
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