博士論文
ImageImage

Fatigue Crack Growth Behavior of Solder Materials

Icons representing 博士論文
The cover of this title could differ from library to library. Link to Help Page

Fatigue Crack Growth Behavior of Solder Materials

Call No. (NDL)
UT51-2001-K955
Bibliographic ID of National Diet Library
000000406176
Persistent ID (NDL)
info:ndljp/pid/3186723
Material type
博士論文
Author
趙杰 [著]
Publisher
[趙杰]
Publication date
2001
Material Format
Paper・Digital
Capacity, size, etc.
1冊
Name of awarding university/degree
長岡技術科学大学,博士 (工学)
View All

Notes on use

Note (General):

博士論文

Table of Contents

  • 論文概要(ABSTRACT)

  • Contents

    p1

  • Chapter One Introduction

    p1

  • 1.1 Microstructural characteristics of Sn-Pb and Sn-Ag solder systems

    p1

  • 1.2 Mechanical behavior of Sn-Pb and Sn-Ag solder systems

    p7

Read in Disability Resources

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper Digital

Material Type
博士論文
Author/Editor
趙杰 [著]
Author Heading
趙, 杰 チョウ, ジー
Publication, Distribution, etc.
Publication Date
2001
Publication Date (W3CDTF)
2001
Extent
1冊
Alternative Title
はんだの疲労き裂伝ぱ特性に関する研究 ハンダ ノ ヒロウ キレツ デンパ トクセイ ニ カンスル ケンキュウ
Degree grantor/type
長岡技術科学大学