半導体プロセス材料実務便覧

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半導体プロセス材料実務便覧

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Material Type: 図書
Title: 半導体プロセス材料実務便覧
Title Transcription: ハンドウタイプロセスザイリョウジツムベンラン
Author/Editor: 原徹, 柏木正弘編集
Author Heading: 原, 徹, 1934- ハラ, トオル, 1934- ( 00129322 )Authorities
柏木, 正弘カシワギ, マサヒロ ( 00137237 )Authorities
Publication, Distribution, etc.: 東京 : サイエンスフォーラム
Publication Date: 1983.4
Publication Date (W3CDTF): 1983
Extent: 468p
Size: 31cm
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: 半導体ハンドウタイ ( 00562913 )Authorities
NDC 8th ed.: 549.8
NDLC: ND371
Target Audience: 一般
Note (General): 限定版
Note (Bibliography): 各章末: 参考文献
Price: 53000円
Holding library: 国立国会図書館
Call No.: ND371-156
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000001639201
http://id.ndl.go.jp/bib/000001639201
National Bibliography No. (JPNO): 84002795
Cataloging Rule: Nippon Cataloging Rules, Preliminary New Edition
Bibliographic Record Category (NDL): 111