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Table of Contents
目次
第1章 TSV(シリコン貫通電極)の技術開発動向
1 ビアエッチング技術/ 1
1.1 現状の技術開発動向/ 1
1.1.1 改良型TMGM(時間多重化ガス変調)プロセスによるシリコンエッチング/ 1
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- Material Type
- 図書
- ISBN
- 978-4-7813-0223-2
- Title
- Title Transcription
- TSV オ チュウシン ト スル SiP ノ サイシン ギジュツ ドウコウ
- Author/Editor
- 山本貴尋 編著
- Series Title
- Author Heading
- 山本, 貴尋 ヤマモト, タカヒロ ( 01192871 )Authorities
- Publication, Distribution, etc.
- Publication Date
- 2010.3
- Publication Date (W3CDTF)
- 2010