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図書

先端半導体パッケージ材料技術

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先端半導体パッケージ材料技術

Call No. (NDL)
ND371-J143
Bibliographic ID of National Diet Library
000010977551
Material type
図書
Author
浅井希 企画編集
Publisher
技術情報協会
Publication date
2010.8
Material Format
Paper
Capacity, size, etc.
387p ; 27cm
NDC
549.8
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Table of Contents

Provided by:国立国会図書館Link to Help Page
  • 目次

  • 第1章 先端半導体パッケージに対応する封止用材料の開発と特性および課題

  • 第1節 半導体封止材用添加剤の特性とその利用技術/ 3

  • はじめに/ 3

  • 1. 無機イオン交換体「IXE」の特長/ 3

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Paper

Material Type
図書
ISBN
978-4-86104-332-1
Title Transcription
センタン ハンドウタイ パッケージ ザイリョウ ギジュツ
Author/Editor
浅井希 企画編集
Author Heading
浅井, 希 アサイ, ノゾミ ( 01142308 )Authorities
Publication, Distribution, etc.
Publication Date
2010.8
Publication Date (W3CDTF)
2010
Extent
387p