International Symposium on Interfacial Joining and Surface Technology : solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013 : November 27-29, 2013 Icho Kaikan, Osaka University, Japan

• Material Type: 図書
• ISBN: 978-4-906110-24-7
• Title: International Symposium on Interfacial Joining and Surface Technology : solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013 : November 27-29, 2013 Icho Kaikan, Osaka University, Japan
• Author Heading: 日本溶接協会 ニホン ヨウセツ キョウカイ ( 00295055 )Authorities
• Publication, Distribution, etc.: [出版地不明] : Technical Commission on Interfacial Joining, Japan Welding Society
• Publication Date: 2013.11
• Publication Date (W3CDTF): 2013
• Extent: 189p
• Size: 30cm
• Place of Publication (Country Code): JP
• Text Language Code: eng
• NDLC: M18
• Target Audience: 一般
• Note (General): 奥付のタイトル: Proceedings of IJST 2013; 共同刊行: Joining and Welding Research Institute, Osaka Universityほか
• Note (Bibliography): 文献あり
• Holding library: 国立国会図書館
• Call No.: M18-B1328
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 025131325; http://id.ndl.go.jp/bib/025131325
• National Bibliography No. (JPNO): 22355525
• Cataloging Rule: Nippon Cataloguing Rules 1987 Revised Edition
• Bibliographic Record Category (NDL): 111

Table of Contents

TECHNICAL PROGRAM

-Oral Presentations-

Wednesday 27 - November

Advanced Surface-Interface Science and Technology (ASI)

Chairs: Shun-Ichiro Tanaka (Tohoku Univ.), Japan

Yasuyuki Miyazawa (Tokai Univ.), Japan

ASI-1 [Invited] "Joining characteristics of Cu-to-Cu couples with copper nanocomposite and its reliability"/ 1