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図書

電子部品用エポキシ樹脂 : 半導体実装材料の最先端技術 (エレクトロニクスシリーズ)

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電子部品用エポキシ樹脂 = Epoxy resin for electronic devices : 半導体実装材料の最先端技術

(エレクトロニクスシリーズ)

Call No. (NDL)
PA441-L79
Bibliographic ID of National Diet Library
026277349
Material type
図書
Author
高橋昭雄 監修
Publisher
シーエムシー出版
Publication date
2015.3
Material Format
Paper
Capacity, size, etc.
270p ; 26cm
NDC
578.43
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Table of Contents

Provided by：国立国会図書館Link to Help Page

  • 目次

  • 【第I編 エポキシ樹脂の物理的性質】

  • 第1章 エポキシ樹脂の種類と特徴

    高橋昭雄

  • 1 エポキシ樹脂とは/ 3

  • 2 電子材料用エポキシ樹脂/ 4

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Paper

Material Type
図書
ISBN
978-4-7813-1059-6
Title
電子部品用エポキシ樹脂 : 半導体実装材料の最先端技術
Title Transcription
デンシ ブヒンヨウ エポキシ ジュシ : ハンドウタイ ジッソウ ザイリョウ ノ サイセンタン ギジュツ
Author/Editor
高橋昭雄 監修
Series Title
エレクトロニクスシリーズ
Author Heading
高橋, 昭雄, 1947- タカハシ, アキオ, 1947- ( 00986018 )Authorities
Publication, Distribution, etc.
東京 : シーエムシー出版
Publication Date
2015.3
Publication Date (W3CDTF)
2015