図書

半導体封止材料総論

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半導体封止材料総論

Call No. (NDL)
ND371-M39
Bibliographic ID of National Diet Library
030097245
Material type
図書
Author
越部茂 著
Publisher
サイエンス&テクノロジー
Publication date
2019.11
Material Format
Paper
Capacity, size, etc.
274p ; 26cm
NDC
549.8
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Table of Contents

  • -目次-

  • 第1部 半導体封止方法および封止材料の基本情報

  • 第1章 樹脂封止および封止材料概論

  • 1. 半導体樹脂封止技術の概要/ 9

  • 1.1 PLPの封止/ 11

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Bibliographic Record

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Paper

Material Type
図書
ISBN
978-4-86428-208-6
Title Transcription
ハンドウタイ フウシ ザイリョウ ソウロン
Author/Editor
越部茂 著
Author Heading
越部, 茂 コシベ, シゲル ( 001271492 )Authorities
Publication, Distribution, etc.
Publication Date
2019.11
Publication Date (W3CDTF)
2019
Extent
274p