次世代パワー半導体の熱設計と実装技術 (エレクトロニクスシリーズ)
次世代パワー半導体の熱設計と実装技術 = Thermal design and packaging technology for WBG power semiconductors
(エレクトロニクスシリーズ)
- Call No. (NDL)
- ND371-M46
- Bibliographic ID of National Diet Library
- 030221879
Detailed bibliographic record
Summary, etc.：
- EV市場をはじめエネルギー分野において、SiCやGaNなどのWBGパワー半導体の需要が高まっている。当書籍では、その実用化にあたって課題となる熱設計に焦点を当て、樹脂材料や基板の開発、冷却・放熱技術を解説する。(Provided by: 出版情報登録センター（JPRO）)
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Table of Contents
目次
第1章 実装技術の現状と展望
1 パワーデバイス高性能化の最前線と今後の展望/ 1
1.1 はじめに/ 1
1.2 SiC/ 2
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Kanto
東京都立中央図書館
Paper- Call No.：
- 549.8-5368-2020
- Book Registration Number：
- 7113310759
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Bibliographic Record
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- Material Type
- 図書
- ISBN
- 978-4-7813-1436-5
- Title
- Title Transcription
- ジセダイ パワー ハンドウタイ ノ ネツセッケイ ト ジッソウ ギジュツ
- Author/Editor
- 菅沼克昭 監修
- Series Title
- Author Heading
- 菅沼, 克昭, 1955- スガヌマ, カツアキ, 1955- ( 00851045 )Authorities
- Publication, Distribution, etc.
- Publication Date
- 2020.1
- Publication Date (W3CDTF)
- 2020