高周波対応基板の材料・要素技術の開発動向
高周波対応基板の材料・要素技術の開発動向
- Call No. (NDL)
- ND633-M109
- Bibliographic ID of National Diet Library
- 032231078
Detailed bibliographic record
Summary, etc.：
- ▼材料の要求特性・開発の方向性が理解できます。◎伝送損失が発生する要因と対策方法◎プリント基板/多層基板、FPCおよび各種実装用高分子に求められる誘電特性◎基板材料として誘電特性と両立して必要な特性（絶縁信頼、耐熱、寸法安定、低吸湿、加工性など）◎高周波基板向けに開発が進む各種の高分子材料の強みと弱...
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Table of Contents
―目次―
第1章 高周波デバイス基板用材料への要求特性
第1節 5G高度化と6Gで求められる高分子材料の技術動向と応用に向けての材料設計
はじめに/ 3
1. エレクトロニクス実装/ 4
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Kanto
東京都立中央図書館
Paper- Call No.：
- 547.4-7939-2022
- Book Registration Number：
- 7116064149
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Bibliographic Record
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- Material Type
- 図書
- ISBN
- 978-4-86428-285-7
- Title
- Title Transcription
- コウシュウハ タイオウ キバン ノ ザイリョウ ・ ヨウソ ギジュツ ノ カイハツ ドウコウ
- Publication, Distribution, etc.
- Publication Date
- 2022.6
- Publication Date (W3CDTF)
- 2022
- Extent
- 312 p
- Size
- 26 cm
- Place of Publication (Country Code)
- JP