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Table of Contents
序論 三次元積層技術の課題と展望
第1章 設計技術
第1節 三次元実装に向けた設計技術（AIチップ）
第2節 チップレット時代のアドバンスド半導体パッケージング設計
第2章 TSV（シリコン貫通電極）
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Kanto
東京都立中央図書館
Paper- Call No.：
- 549.8-5469-2025
- Book Registration Number：
- 7119895198
横浜市立図書館
Paper- Call No.：
- 549.8
- Book Registration Number：
- 2079287701
other
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- Material Type
- 図書
- ISBN
- 978-4-86043-988-0
- Title
- Title Transcription
- スリーディー ハンドウタイ ジッソウ ギジュツ
- Author/Editor
- 福島誉史 監修
- Author Heading
- 監修者 ： 福島, 誉史 フクシマ, タカフミ ( 034439012 )Authorities
- Publication, Distribution, etc.
- Publication Date
- 2025.10
- Publication Date (W3CDTF)
- 2025
- Extent
- 294,9p 図版30p