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Table of Contents
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第１章 半導体パッケージングロードマップ
～今までの研究の歴史と現在の着地点、今後の動向～
1. 真空管の誕生
2. トランジスタの誕生
3. 半導体の誕生とパッケージング技術
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- Material Type
- 図書
- ISBN
- 978-4-86502-292-6
- Title Transcription
- ジセダイ ニ ムケタ ハンドウタイ パッケージング ギジュツ : サイセンタン ハンドウタイ エノ タイオウ カラ トラブル タイサク マデ
- Publication, Distribution, etc.
- Publication Date
- 2025.11
- Publication Date (W3CDTF)
- 2025
- Extent
- 259 p
- Size
- 26 cm
- Place of Publication (Country Code)
- JP