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図書

次世代パワー半導体の熱設計と実装技術 普及版 (TECHNICAL LIBRARY. エレクトロニクスシリーズ)

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次世代パワー半導体の熱設計と実装技術 = Thermal Design and Packaging Technology for WBG Power Semiconductors

普及版

(TECHNICAL LIBRARY. エレクトロニクスシリーズ)

Call No. (NDL)
ND371-R51
Bibliographic ID of National Diet Library
034479906
Material type
図書
Author
菅沼克昭 監修
Publisher
シーエムシー出版
Publication date
2026.1
Material Format
Paper
Capacity, size, etc.
304p ; 26cm
NDC
549.8
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Detailed bibliographic record

Summary, etc.：

SiCやGaNなどWBGパワー半導体の高温・高速・高耐圧動作を支える熱設計技術を解説し、EV向け車載パワーモジュールの高出力密度化に迫る1冊。(Provided by: 出版情報登録センター（JPRO）)

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Table of Contents

Provided by：出版情報登録センター（JPRO）

  • 第1章　実装技術の現状と展望

  • 1　パワーデバイス高性能化の最前線と今後の展望

  • 1.1　はじめに

  • 1.2　SiC

  • 1.3　RC-IGBT

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Bibliographic Record

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Paper

Material Type
図書
ISBN
978-4-7813-1850-9
Title
次世代パワー半導体の熱設計と実装技術
Title Transcription
ジセダイ パワー ハンドウタイ ノ ネツセッケイ ト ジッソウ ギジュツ
Author/Editor
菅沼克昭 監修
Edition
普及版
Series Title
TECHNICAL LIBRARY. エレクトロニクスシリーズ
Author Heading
監修者 ： 菅沼, 克昭, 1955- スガヌマ, カツアキ, 1955- ( 00851045 )Authorities
Publication, Distribution, etc.
東京 : シーエムシー出版 (出版)
Publication Date
2026.1