第 1 部 (3) 薄膜接合材料の界面強度評価

• Material Type: 記事
• Title: 第 1 部 (3) 薄膜接合材料の界面強度評価
• Author/Editor: 平方,寛之; 北村,隆行
• Publication, Distribution, etc.: 日本 : 日本機械学会
• Publication Date: 2003-03-27
• Publication Date (W3CDTF): 2003-03-27
• Alternative Title: Evaluation of Interface Strength between Thin Films
• Periodical title: 材料力学部門春のシンポジウム講演論文集
• No. or year of volume/issue: 2003
• Volume: 2003
• Pages: 11-16
• Text Language Code: JPN
• Alias of Author: HIRAKATA,Hiroyuki; KITAMURA,Takayuki
• Subject Heading: Delamination; Interface Strength; Material Testing; Interface Edge; Thin Film; Copper Film; Micro Material; Atomic Force Microscopy
• Note (General): 著者所属: 京大工; Affiliation: Department of Engineering Physics and Mechanics, Kyoto University
• Persistent ID (NDL): info:ndljp/pid/10351209; https://dl.ndl.go.jp/pid/10351209
• Collection: 障害者向け資料
• Collection (Materials For Handicapped People:1): テキストデータ
• Collection (particular): 国立国会図書館デジタルコレクション > 電子書籍・電子雑誌 > 学術機関 > 学協会; https://dl.ndl.go.jp/collections/B00043
• Acquisition Basis: NII-ELS
• Available (W3CDTF): 2017-06-22
• Date Accepted (W3CDTF): 2017-05-19
• Date Captured (W3CDTF): 2017-05-19
• Format (IMT): application/pdf
• Access Restrictions: インターネット公開
• Availability of remote photoduplication service: 不可
• Periodical Title (Persistent ID (NDL)): info:ndljp/pid/10356242; https://dl.ndl.go.jp/pid/10356242
• Data Provider (Database): 国立国会図書館 : 国立国会図書館デジタルコレクション; https://dl.ndl.go.jp

• Summary, etc.: The delamination strength of interface between Cu and TiN thin films considering the internal stress in the films is evaluated. The results show that ...