B-11 半導体デバイスにおける微細 Al および Cu 配線の断線解析
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- Material Type
- 記事
- Author/Editor
- 北村,隆行澁谷,忠弘
- Publication, Distribution, etc.
- Publication Date
- 2000-03-29
- Publication Date (W3CDTF)
- 2000-03-29
- Alternative Title
- Failure Analysis of Al and Cu Micro-wires in an LSI chip
- Periodical title
- 材料力学部門分科会・研究会合同シンポジウム講演論文集
- No. or year of volume/issue
- 2000
- Volume
- 2000