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B-11 半導体デバ...

B-11 半導体デバイスにおける微細 Al および Cu 配線の断線解析

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B-11 半導体デバイスにおける微細 Al および Cu 配線の断線解析

Persistent ID (NDL)
info:ndljp/pid/10351773
Material type
記事
Author
北村,隆行ほか
Publisher
日本機械学会
Publication date
2000-03-29
Material Format
Digital
Journal name
材料力学部門分科会・研究会合同シンポジウム講演論文集 2000
Publication Page
p.73-78
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Notes on use

Note (General):

著者所属: 京大工著者所属: 京大院Affiliation: Kyoto University

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Digital

Material Type
記事
Author/Editor
北村,隆行
澁谷,忠弘
Publication, Distribution, etc.
Publication Date
2000-03-29
Publication Date (W3CDTF)
2000-03-29
Alternative Title
Failure Analysis of Al and Cu Micro-wires in an LSI chip
Periodical title
材料力学部門分科会・研究会合同シンポジウム講演論文集
No. or year of volume/issue
2000
Volume
2000