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電子書籍・電子雑誌JJAP series
Volume number4
Study on R...

Study on Reaction Mechanism of Aluminum Selective Chemical Vapor Deposition with In-situ XPS Measurement : Etching and Deposition Technology

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Study on Reaction Mechanism of Aluminum Selective Chemical Vapor Deposition with In-situ XPS Measurement : Etching and Deposition Technology

Persistent ID (NDL)
info:ndljp/pid/10472332
Material type
記事
Author
KAWAMOTO,Hideakiほか
Publisher
Japanese Journal of Applied Physics
Publication date
1991-01-31
Material Format
Digital
Journal name
JJAP series 4
Publication Page
p.218-222
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Notes on use

Note (General):

著者所属: Department of Electrical engineering, Hiroshima University

Detailed bibliographic record

Summary, etc.:

Aluminum (Al) films have been deposited selectively on Si at a substrate temperature from 270 to 330℃ under 1×10^<-3> Torr employing dimethylaluminum ...

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Digital

Material Type
記事
Author/Editor
KAWAMOTO,Hideaki
SAKAUE,Hiroyuki
TAKEHIRO,Shinobu
HORIIKE,Yasuhiro
Publication, Distribution, etc.
Publication Date
1991-01-31
Publication Date (W3CDTF)
1991-01-31
Periodical title
JJAP series
No. or year of volume/issue
4
Volume
4
Pages
218-222