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Fracture mechanics evaluation of Cu/SiN interface adhesion strength in the multilayer thin film structure of LSI interconnects
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Bibliographic Record
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- Material Type
- 博士論文
- Author/Editor
- Chen Chuantong
- Publication, Distribution, etc.
- Publication Date
- 2016
- Publication Date (W3CDTF)
- 2016
- Alternative Title
- 集積回路内部多層薄膜配線構造におけるCu/SiN界面密着強度の破壊力学的評価
- Degree grantor/type
- 名古屋工業大学
- Date Granted
- 2016-09-07
- Date Granted (W3CDTF)
- 2016-09-07