高密度電子部品の実装ソルダリングについて (フォーラム「微細接合技術の現状と接合部特性」)
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- Material Type
- 記事
- Author/Editor
- 横井,和雄
- Publication, Distribution, etc.
- Publication Date
- 1990-09-18
- Publication Date (W3CDTF)
- 1990-09-18
- Alternative Title
- Soldering of High-Density PCBAs : Printed-Circuit-Board Assemblies
- Periodical title
- 溶接学会全国大会講演概要
- No. or year of volume/issue
- (47)
- Volume
- (47)