博士論文
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半導体デバイスの開封前に適用可能な超音波加熱を利用した故障箇所絞込み技術

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半導体デバイスの開封前に適用可能な超音波加熱を利用した故障箇所絞込み技術

Persistent ID (NDL)
info:ndljp/pid/12219003
Material type
博士論文
Author
松井 , 拓人
Publisher
-
Publication date
2022-03-23
Material Format
Digital
Capacity, size, etc.
-
Name of awarding university/degree
豊橋技術科学大学,博士(工学)
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Notes on use

Note (General):

source:https://www.tut.ac.jp/university/docs/abstk884.pdf

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Digital

Material Type
博士論文
Author/Editor
松井 , 拓人
Author Heading
Publication Date
2022-03-23
Publication Date (W3CDTF)
2022-03-23
Alternative Title
Fault Location Technique Using Ultrasonic Heating Applicable to Semiconductor Devices prior to Decapsulation
Degree grantor/type
豊橋技術科学大学
Date Granted
2022-03-23
Date Granted (W3CDTF)
2022-03-23