CMP後洗浄のスピンリンス工程におけるウェーハ表面への液中粒子再付着メカニズムに関する研究
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- Material Type
- 記事
- Author/Editor
- 半田直廉檜山浩國天谷賢児
- Publication, Distribution, etc.
- Publication Date
- 2023-04
- Publication Date (W3CDTF)
- 2023-04
- Alternative Title
- Study on re-adhesion mechanism of detached nanoparticles to wafer surface during spin rinse process in post CMP cleaning process
- Periodical title
- エバラ時報
- No. or year of volume/issue
- (265)
- Volume
- (265)