CMP後洗浄のスピンリンス工程におけるウェーハ表面への液中粒子再付着メカニズムに関する研究
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- Material Type
- 記事
- Author/Editor
- 半田直廉檜山浩國天谷賢児
- Publication, Distribution, etc.
- Publication Date
- 2023-04
- Publication Date (W3CDTF)
- 2023-04
- Alternative Title
- Study on re-adhesion mechanism of detached nanoparticles to wafer surface during spin rinse process in post CMP cleaning process
- Periodical title
- エバラ時報
- No. or year of volume/issue
- (265)
- Volume
- (265)
- Text Language Code
- jpn
- Persistent ID (NDL)
- info:ndljp/pid/13381509
- Collection
- Collection (Materials For Handicapped People:1)
- Collection (particular)
- 国立国会図書館デジタルコレクション > 電子書籍・電子雑誌 > その他
- Acquisition Basis
- オンライン資料収集制度
- Date Accepted (W3CDTF)
- 2024-03-18T10:02:43+09:00
- Date Captured (W3CDTF)
- 2023-07-21
- Format (IMT)
- application/pdf
- Access Restrictions
- 国立国会図書館内限定公開
- Service for the Digitized Contents Transmission Service
- 図書館・個人送信対象外
- Availability of remote photoduplication service
- 可
- Periodical Title (URI)
- Periodical Title (Persistent ID (NDL))
- info:ndljp/pid/13381504
- Data Provider (Database)
- 国立国会図書館 : 国立国会図書館デジタルコレクション