高周波基板用銅箔・シミュレーションと高速デジタル回路の検討
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- Material Type
- 記事
- Author/Editor
- 鳥光悟齋藤貴広
- Publication, Distribution, etc.
- Publication Date
- 2019-02
- Publication Date (W3CDTF)
- 2019-02
- Alternative Title
- Copper foil for PCB, simulation and study on high-speed digital circuits
- Periodical title
- 古河電工時報
- No. or year of volume/issue
- (138)
- Volume
- (138)