DVScPを用いた次世代多層配線向け新規CuバリアSiC成膜プロセス技術
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- Material Type
- 記事
- Author/Editor
- 中平順也稲石美明中尾慎一
- Publication, Distribution, etc.
- Publication Date
- 2008-11-28
- Publication Date (W3CDTF)
- 2008-11-28
- Extent
- 容量 : tnscgihou27_04.pdf(994198bytes)
- Alternative Title
- A novel Cu diffusion barrier-SiC film deposited with DVScP for Cu multilevel interconnects of 45-nm node and beyond
- Periodical title
- 大陽日酸技報
- No. or year of volume/issue
- (27)