高圧アニールプロセスの半導体デバイス用デュアルダマシン銅配線形成への応用
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- Material Type
- 記事
- Author/Editor
- 大西隆逸見義男吉川哲也
- Publication, Distribution, etc.
- Publication Date
- 2002-09-01
- Publication Date (W3CDTF)
- 2002-09-01
- Alternative Title
- The application of high pressure annealing to damascene-fabricated Cu interconnections in ULSI devices
- Periodical title
- R&D神戸製鋼技報
- No. or year of volume/issue
- (201)
- Volume
- (201)