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Prediction of Drying Shrinkage Cracking of Steel Chip Reinforced Polymer Cementitious Composites Considering Bond and Tensile Creep
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国立国会図書館デジタルコレクション
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DOI[10.14989/doctor.k19300]to the data of the same series
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- Material Type
- 博士論文
- Author/Editor
- Sunhee, Hong
- Author Heading
- Publication, Distribution, etc.
- Publication Date
- 2015-09-24
- Publication Date (W3CDTF)
- 2015-09-24
- Alternative Title
- スチールチップ補強ポリマーセメント系複合材料の付着と引張クリープを考慮した乾燥収縮ひび割れの予測
- Contributor
- 金子, 佳生田中, 仁史竹脇, 出
- Degree grantor/type
- 京都大学