Enhancement of pressure-free bonding with Cu nanoparticles using Ni affinity layers and Ni alloy nanoparticles
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- Material Type
- 記事
- Author/Editor
- Toshitaka IshizakiRyota Watanabe
- Publication, Distribution, etc.
- Publication Date
- 2015-12
- Publication Date (W3CDTF)
- 2015-12
- Alternative Title
- Ni密着層およびNi合金ナノ粒子によるCuナノ粒子無加圧接合の高強度化
- Periodical title
- R&D review of Toyota CRDL
- No. or year of volume/issue
- 46(4)
- Volume
- 46(4)