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Effects of microstructural heterogeneity on BGA reliability SAND981649C DE98 003973 CONF980819

Effects of microstructural heterogeneity on BGA reliability SAND981649C DE98 003973 CONF980819
Microform規格・テクニカルリポート類
Neilsen, M. K, Burchett, S. N, Fang, H. E, Vianco, P. T1998<LS-DE98/003973>
National Diet Library

Computational continuum modeling of solder interconnects: Applications SAND-97-0672C DE97 004032 CONF-9706167

Computational continuum modeling of solder interconnects: Applications SAND-97-0672C DE97 004032 CONF-9706167
Microform規格・テクニカルリポート類
Burchett, S. N, Neilsen, M. K, Frear, D. R1997<LS-DE97/004032>
National Diet Library

Validating theoretical calculations of thermomechanical stress and deformation using the ATC4.1 flip-chip test vehicle SAND-97-1969C DE97 008360 CONF-9709772

Validating theoretical calculations of thermomechanical stress and deformation using the ATC4.1 flip-chip test vehicle SAND-97-1969C DE97 008360 CONF-9709772
Microform規格・テクニカルリポート類
Peterson, D. W, Sweet, J. N, Burchett, S. N1997<LS-DE97/008360>
National Diet Library

Computational continuum modeling of solder interconnects SAND-97-0382C DE97 003205 CONF-97020117

Computational continuum modeling of solder interconnects SAND-97-0382C DE97 003205 CONF-97020117
Microform規格・テクニカルリポート類
Burchett, S. N, Neilsen, M. K, Frear, D. R, Stephens, J. J1997<LS-DE97/003205>
National Diet Library

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method SAND-96-2616C DE97 003842 CONF-9705692

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method SAND-96-2616C DE97 003842 CONF-9705692
Microform規格・テクニカルリポート類
Peterson, D. W, Sweet, J. N, Burchett, S. N, Hsia, A1996<LS-DE97/003842>
National Diet Library

Viscoplastic theory for braze alloys SAND-96-0984 DE96 010384

Viscoplastic theory for braze alloys SAND-96-0984 DE96 010384
Microform規格・テクニカルリポート類
Neilsen, M. K, Burchett, S. N, Stone, C. M, Stephens, J. J1996<LS-DE96/010384>
National Diet Library

Microstructurally based finite element simulation of solder joint behavior SAND-96-0056C DE96 004647 CONF-9602511

Microstructurally based finite element simulation of solder joint behavior SAND-96-0056C DE96 004647 CONF-9602511
Microform規格・テクニカルリポート類
Frear, D. R, Burchett, S. N, Neilsen, M. K, Stephens, J. J1996<LS-DE96/004647>
National Diet Library

Comparison of LBW and GTAW processes in miniature closure welds SAND-95-1149C DE95 015084 CONF-9506822

Comparison of LBW and GTAW processes in miniature closure welds SAND-95-1149C DE95 015084 CONF-9506822
Microform規格・テクニカルリポート類
Knorovsky, G. A, Fuerschbach, P. W, Gianoulakis, S. E, Burchett, S. N1995<LS-DE95/015084>
National Diet Library

Effect of travel speed on thermal response in CO2 laser welding of small electronic components SAND-94-3231C DE95 006314 CONF-9508285

Effect of travel speed on thermal response in CO2 laser welding of small electronic components SAND-94-3231C DE95 006314 CONF-9508285
Microform規格・テクニカルリポート類
Gianoulakis, S. E, Burchett, S. N, Fuerschbach, P. W, Knorovsky, G. A1995<LS-DE95/006314>
National Diet Library

Microstructurally based model of solder joints under conditions of thermomechanical fatigue SAND-94-0951C DE95 006226 CONF-9503445

Microstructurally based model of solder joints under conditions of thermomechanical fatigue SAND-94-0951C DE95 006226 CONF-9503445
Microform規格・テクニカルリポート類
Frear, D. R, Burchett, S. N, Rashid, M. M1994<LS-DE95/006226>
National Diet Library

VISCOPLASTIC THEORY FOR BRAZE ALLOYS. (SAND ; SAND-96-0984)

VISCOPLASTIC THEORY FOR BRAZE ALLOYS. (SAND ; SAND-96-0984)
Paper図書
NEILSEN, M.K.// BURCHETT, S.N.// STONE, C.M.// STEPHENS, J.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES)).Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingNEILSEN, M.K. BURCHETT, S.N. STONE, C.M. STEPHENS, J.J.

MICROSTRUCTURALLY BASED FINITE ELEMENT SIMULATION OF SOLDER JOINT BEHAVIOR (SAND ; SAND-96-0056C)

MICROSTRUCTURALLY BASED FINITE ELEMENT SIMULATION OF SOLDER JOINT BEHAVIOR (SAND ; SAND-96-0056C)
Paper図書
FREAR, D.R.// BURCHETT, S.N.// NEILSEN, M.K.// STEPHENS, J.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingFREAR, D.R. BURCHETT, S.N. NEILSEN, M.K. STEPHENS, J.J.

EFFECT OF TRAVEL SPEED ON THERMAL RESPONSE IN CO/SUB 2/ LASER WELDING OF SMALL ELECTRONIC COMPONENTS (SAND ; SAND-94-3231C)

EFFECT OF TRAVEL SPEED ON THERMAL RESPONSE IN CO/SUB 2/ LASER WELDING OF SMALL ELECTRONIC COMPONENTS (SAND ; SAND-94-3231C)
Paper図書
GIANOULAKIS, S.E.// BURCHETT, S.N.// FUERSCHBACH, P.W.// KNOROVSKY, G.A. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingGIANOULAKIS, S.E. BURCHETT, S.N. FUERSCHBACH, P.W. KNOROVSKY, ...

COMPARISON OF LBW AND GTAW PROCESSES IN MINIATURE CLOSURE WELDS (SAND ; SAND-95-1149C)

COMPARISON OF LBW AND GTAW PROCESSES IN MINIATURE CLOSURE WELDS (SAND ; SAND-95-1149C)
Paper図書
KNOROVSKY, G.A.// FUERSCHBACH, P.W.// GIANOULAKIS, S.E.// BURCHETT, S.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingKNOROVSKY, G.A. FUERSCHBACH, P.W. GIANOULAKIS, S.E. BURCHETT, S.N.

STRESS ANALYSIS OF PLATED-THROUGH-HOLES IN RIGID FLEX MULTILAYER PRINTED WIRING BOARDS (SAND ; SAND-92-0271C)

STRESS ANALYSIS OF PLATED-THROUGH-HOLES IN RIGID FLEX MULTILAYER PRINTED WIRING BOARDS (SAND ; SAND-92-0271C)
Paper図書
BURCHETT, S.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1992.
Other Libraries in Japan
  • Author HeadingBURCHETT, S.N.

MICROSTRUCTURALLY BASED MODEL OF SOLDER JOINTS UNDER CONDITIONS OF THERMOMECHANICAL FATIGUE (SAND ; SAND-94-0951C)

MICROSTRUCTURALLY BASED MODEL OF SOLDER JOINTS UNDER CONDITIONS OF THERMOMECHANICAL FATIGUE (SAND ; SAND-94-0951C)
Paper図書
FREAR, D.R.// BURCHETT, S.N.// RASHID, M.M. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingFREAR, D.R. BURCHETT, S.N. RASHID, M.M.

EXTENSIONS OF "SOME GUIDELINES FOR THE MECHANICAL DESIGN OF COAXIAL COMPRESSION PIN SEALS" (SAND ; SAND-93-0306)

EXTENSIONS OF "SOME GUIDELINES FOR THE MECHANICAL DESIGN OF COAXIAL COMPRESSION PIN SEALS" (SAND ; SAND-93-0306)
Paper図書
CHAMBERS, R.S.// BURCHETT, S.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1993.
Other Libraries in Japan
  • Author HeadingCHAMBERS, R.S. BURCHETT, S.N.

MICROSTRUCTURALLY BASED THERMOMECHANICAL FATIGUE LIFETIME MODEL OF SOLDER JOINTS FOR ELECTRONIC APPLICATIONS (SAND ; SAND-93-1181C)

MICROSTRUCTURALLY BASED THERMOMECHANICAL FATIGUE LIFETIME MODEL OF SOLDER JOINTS FOR ELECTRONIC APPLICATIONS (SAND ; SAND-93-1181C)
Paper図書
FREAR, D.R.// RASHID, M.M.// BURCHETT, S.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1993.
Other Libraries in Japan
  • Author HeadingFREAR, D.R. RASHID, M.M. BURCHETT, S.N.

EXPERIMENTAL/ANALYTICAL COMPARISON OF STRAINS IN ENCAPSULATED ASSEMBLIES (SAND ; SAND-90-0294)

EXPERIMENTAL/ANALYTICAL COMPARISON OF STRAINS IN ENCAPSULATED ASSEMBLIES (SAND ; SAND-90-0294)
Paper図書
GUESS, T.R.// BURCHETT, S.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingGUESS, T.R. BURCHETT, S.N.

STRESS ANALYSIS OF A LEADLESS CHIP CARRIER SOLDERED TO A CERAMIC SUBSTRATE (SAND ; SAND-90-0750C)

STRESS ANALYSIS OF A LEADLESS CHIP CARRIER SOLDERED TO A CERAMIC SUBSTRATE (SAND ; SAND-90-0750C)
Paper図書
BURCHETT, S.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingBURCHETT, S.N.
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