Search results 7
Paper図書
National Diet LibraryOther Libraries in Japan
- Summary, etc.... professionals in both academia and industry, covering the fundament......ecture, processing details, and ......ectronic packaging. It provides readers an in-depth understanding of the latest......d development findings regarding this key industry trend, including TSV, die processing, micro-bumps ......MI, direct bonding and advanced materials, as ......Readers will gain a general grasp of 3D packaging, quality and ......e, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and deve...
- Contents1. Introduction to 3......ectronic packaging 2. 3D packaging architecture ...... of TSV processing and reliabili......TSV Protrusion/Intrusion 6. Fund......s and failures in Die preparation for 3D packaging 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging 8. Emerging hybrid bonding techniques for 3D packaging 9. Fundamenta......ompressive Bonding process, advanced epoxy, and flux materials in 3D packaging 10. Fundament...... solder alloys in 3D packaging 11. Fundament......ctro migration in interconnects of ......at dissipation in 3D packaging 13. Fundamentals of advanced materials and process in subs...
- Subject HeadingMicroelectronics--Packaging Electronic ci......-Materials. Engineering. Metals. Microelectronics. Nanotechnology. Optical mate...
Paper図書
National Diet LibraryOther Libraries in Japan
- Related Material1850-9999 Advanced microelectronics
- Periodical TitleAdvanced microelectronics
- Title HeadingSpringer series in advanced microelectronics ; 61.
Paper図書
National Diet Library
- Summary, etc.... professionals in both academia and industry on the f......entals, processing details, and ......ectronic packaging, an industry trend fo......ch results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, hea......echanical modeling, quality, rel......schematics are included througho......eaders with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mech......ilures, developing areas, and fu......llenges, providing insights into key areas fo......ate-of-the-art in 3D microelectronic packages C...
- ContentsIntroduction to 3......ectronic Packaging 3D packaging architecture ......als and Processing of TSV Micros......s and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging Fundamental o......ompression Bonding Technology an...... solder alloys in 3D packaging Fundamentals ......ectromigration in interconnects of ......at dissipation in 3D IC packaging Fundamentals of advanced materials and processes in organic substr......sture Stresses in 3-D Packaging: Modeling and Characterization Processing and Reliability of Solder Interconnections in Stacked Pack...
- Subject HeadingMicroelectronics--Packaging.
Paper図書
National Diet Library
- Contents... design guides in electronic packaging Characterizat......ectronic packaging materials and......heir functions in thermal manage......osites Thermal interface materials in electronic packaging Materials and design for advanced heat spreader and air cooling heat sinks Liquid cooling devices and t......moelectric cooling through therm......application of advanced thermal manage......mal management in electronic industry.
- Subject HeadingElectronic apparatus and appliances--Temperature control. Electronic packaging--Materials.
- Title HeadingSpringer series in advanced microelectronics ; 30.
Paper図書
National Diet LibraryOther Libraries in Japan
- Subject HeadingElectromagnetism. Energy harvesting. Vibration transducers. Elec...
- Related MaterialAdvanced microelectronics
- Periodical TitleAdvanced microelectronics
Paper図書
National Diet Library
- Subject Heading... construction. Integrated circui......ry large scale integration -- Design and constr...
Paper図書
Other Libraries in Japan
- Related MaterialAdvanced materials for ......ectronic packaging Noise in Semiconductor Devices : Modeling and Simulation Lock-in thermography :......use for evaluating electronic de...... embedded SRAM in high-performan......crocontrollers in practice Optoe......ronic circuits in nanometer CMOS......ontrollers and interfaces Variat......circuit design in emerging multi-gate CM...... physics, modeling, applications......(HDR) vision : microelectronics, image processing, computer gra......gital circuits in deep sub-micro......hnologies Lock-in thermography :...... signal processing : technical r......wer VCO design in CMOS Low power and reliable S...
- Alternative TitleSpringer-Verlag series in advanced microelectronics Springer series in advanced microelectronics
- Alternative TitleSpringer-Verlag series in advanced microelectronics Springer series in advanced microelectronics