年 〜
年

検索結果 16 件

Solder materials (WSPC series in advanced integration and packaging ; vol. 6)

Solder materials (WSPC series in advanced integration and packaging ; vol. 6)
紙図書
Kwang-Lung Lin.World Scientific Publishing Co. Pte. Ltd.[2018]<PD51-B18>
国立国会図書館

Recent Progress in Soldering Materials

Recent Progress in Soldering Materials
デジタル電子書籍・電子雑誌図書
2017
インターネットで読める国立国会図書館

Study on creep-fatigue crack growth behavior of solder materials

Study on creep-fatigue crack growth behavior of solder materials
紙博士論文
Fakpan Kittichai [著][Fakpan Kittichai][2013]<UT51-2013-K704>
国立国会図書館

Packaging, chip-package interactions and solder materials challenges : April 13-17, 2009 : San, [sic] Francisco, California, USA. : Apr 2009, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 1158)

Packaging, chip-package interactions and solder materials challenges : April 13-17, 2009 : San, [sic] Francisco, California, USA. : Apr 2009, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 1158)
紙図書
Materials Research Societyc2009.<M17-10-2183>
国立国会図書館

Fatigue Crack Growth Behavior of Solder Materials

Fatigue Crack Growth Behavior of Solder Materials
紙デジタル博士論文障害者向け資料あり
趙杰 [著][趙杰]2001<UT51-2001-K955>
インターネットで読める国立国会図書館

A review of some non-lead solder material technologies for use in surface-mount microelectronics ASME-99-IMECE/EEP-16

A review of some non-lead solder material technologies for use in surface-mount microelectronics ASME-99-IMECE/EEP-16
紙規格・テクニカルリポート類
Rafanelli, Anthony J1999<M-ASME-99-IMECE/EEP-16>
国立国会図書館

Solder materials

Solder materials
紙図書
Kwang-Lung LinWorld Scientificc2018
全国の図書館

Lead-free solders : materials reliability for electronics

Lead-free solders : materials reliability for electronics
紙図書
edited by K.N. SubramanianWiley2012
全国の図書館

Solders and soldering : materials, design, production, and analysis for reliable bonding 4th ed

Solders and soldering : materials, design, production, and analysis for reliable bonding 4th ed
紙図書
Howard H. MankoMcGraw-Hillc2001
全国の図書館

DAMAGE MECHANICS BASED FATIGUE LIFE PREDICTION FOR 63SN-37PB SOLDER MATERIALS (SAND ; SAND-2000-1886C)

DAMAGE MECHANICS BASED FATIGUE LIFE PREDICTION FOR 63SN-37PB SOLDER MATERIALS (SAND ; SAND-2000-1886C)
紙図書
Y. WEI// ET AL. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM)Sandia National Laboratories(Sandia National Laboratories)2000.
全国の図書館

CHARACTERISTICS OF CREEP DAMAGE FOR 60SN-40PB SOLDER MATERIAL (SAND ; SAND-99-2204C)

CHARACTERISTICS OF CREEP DAMAGE FOR 60SN-40PB SOLDER MATERIAL (SAND ; SAND-99-2204C)
紙図書
Y. WEI// ET AL. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM)Sandia National Laboratories(Sandia National Laboratories)1999.
全国の図書館

Solders and soldering : materials, design, production, and analysis for reliable bonding 3rd ed

Solders and soldering : materials, design, production, and analysis for reliable bonding 3rd ed
紙図書
Howard H. MankoMcGraw-Hillc1992
全国の図書館

Solders and soldering : materials, design, production, and analysis for reliable bonding 2nd ed

Solders and soldering : materials, design, production, and analysis for reliable bonding 2nd ed
紙図書
Howard H. MankoMcGraw-Hillc1979
全国の図書館

Solders and soldering : materials, design, production, and analysis for reliable bonding

Solders and soldering : materials, design, production, and analysis for reliable bonding
紙図書
Howard H. MankoMcGraw-Hillc1964
全国の図書館

WSPC Series in Advanced Integration and Packaging

WSPC Series in Advanced Integration and Packaging
紙図書
Series editors, Avram Bar-Cohen, Shi-Wei Ricky LeeWorld Scientific
全国の図書館
  • 関連情報Design and modeling for 3D ICs and interposers Cost analysis of electronic systems Solder materials

Wiley series in materials for electronic and optoelectronic applications

Wiley series in materials for electronic and optoelectronic applications
紙図書
Wiley
全国の図書館

検索結果は以上です。