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Characterization of the mechanical properties of LTCC ''Green Tape''(trademark) for the MC4352 MET SAND-97-0497 DE97 004348

Characterization of the mechanical properties of LTCC ''Green Tape''(trademark) for the MC4352 MET SAND-97-0497 DE97 004348
Microform規格・テクニカルリポート類
Uribe, F, Garrett, S, Monroe, S, Burchett, S1997<LS-DE97/004348>
National Diet Library

Quantitative prediction of stresses during thermoset cure SAND-96-1589C DE96 011718 CONF-9607864

Quantitative prediction of stresses during thermoset cure SAND-96-1589C DE96 011718 CONF-9607864
Microform規格・テクニカルリポート類
Adolf, D, Chambers, B, Burchett, S1996<LS-DE96/011718>
National Diet Library

Flat panel display development activities at Sandia National Laboratories SAND-94-3109C DE95 005442 CONF-95051571

Flat panel display development activities at Sandia National Laboratories SAND-94-3109C DE95 005442 CONF-95051571
Microform規格・テクニカルリポート類
DiBello, E. G, Worobey, W, Burchett, S, Hareland, W, Felter, T1994<LS-DE95/005442>
National Diet Library

QUANTITATIVE PREDICTION OF STRESSES DURING THERMOSET CURE (SAND ; SAND-96-1589C)

QUANTITATIVE PREDICTION OF STRESSES DURING THERMOSET CURE (SAND ; SAND-96-1589C)
Paper図書
ADOLF, D.// CHAMBERS, B.// BURCHETT, S. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingADOLF, D. CHAMBERS, B. BURCHETT, S.

FLAT PANEL DISPLAY DEVELOPMENT ACTIVITIES AT SANDIA NATIONAL LABORATORIES (SAND ; SAND-94-3109C)

FLAT PANEL DISPLAY DEVELOPMENT ACTIVITIES AT SANDIA NATIONAL LABORATORIES (SAND ; SAND-94-3109C)
Paper図書
DIBELLO, E.G.// WOROBEY, W.// BURCHETT, S.// HARELAND, WA.// FELTER, T.// MAYS, B. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingDIBELLO, E.G. WOROBEY, W. BURCHETT, S. HARELAND, WA. FELTER, T. MAYS...

Validating theoretical calculations of thermomechanical stress and deformation using the ATC4.1 flip-chip test vehicle SAND-97-1969C DE97 008360 CONF-9709772

Validating theoretical calculations of thermomechanical stress and deformation using the ATC4.1 flip-chip test vehicle SAND-97-1969C DE97 008360 CONF-9709772
Microform規格・テクニカルリポート類
Peterson, D. W, Sweet, J. N, Burchett, S. N1997<LS-DE97/008360>
National Diet Library

Computational continuum modeling of solder interconnects: Applications SAND-97-0672C DE97 004032 CONF-9706167

Computational continuum modeling of solder interconnects: Applications SAND-97-0672C DE97 004032 CONF-9706167
Microform規格・テクニカルリポート類
Burchett, S. N, Neilsen, M. K, Frear, D. R1997<LS-DE97/004032>
National Diet Library

Effects of microstructural heterogeneity on BGA reliability SAND981649C DE98 003973 CONF980819

Effects of microstructural heterogeneity on BGA reliability SAND981649C DE98 003973 CONF980819
Microform規格・テクニカルリポート類
Neilsen, M. K, Burchett, S. N, Fang, H. E, Vianco, P. T1998<LS-DE98/003973>
National Diet Library

Computational continuum modeling of solder interconnects SAND-97-0382C DE97 003205 CONF-97020117

Computational continuum modeling of solder interconnects SAND-97-0382C DE97 003205 CONF-97020117
Microform規格・テクニカルリポート類
Burchett, S. N, Neilsen, M. K, Frear, D. R, Stephens, J. J1997<LS-DE97/003205>
National Diet Library

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method SAND-96-2616C DE97 003842 CONF-9705692

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method SAND-96-2616C DE97 003842 CONF-9705692
Microform規格・テクニカルリポート類
Peterson, D. W, Sweet, J. N, Burchett, S. N, Hsia, A1996<LS-DE97/003842>
National Diet Library

Microstructurally based finite element simulation of solder joint behavior SAND-96-0056C DE96 004647 CONF-9602511

Microstructurally based finite element simulation of solder joint behavior SAND-96-0056C DE96 004647 CONF-9602511
Microform規格・テクニカルリポート類
Frear, D. R, Burchett, S. N, Neilsen, M. K, Stephens, J. J1996<LS-DE96/004647>
National Diet Library

Viscoplastic theory for braze alloys SAND-96-0984 DE96 010384

Viscoplastic theory for braze alloys SAND-96-0984 DE96 010384
Microform規格・テクニカルリポート類
Neilsen, M. K, Burchett, S. N, Stone, C. M, Stephens, J. J1996<LS-DE96/010384>
National Diet Library

Microstructurally based model of solder joints under conditions of thermomechanical fatigue SAND-94-0951C DE95 006226 CONF-9503445

Microstructurally based model of solder joints under conditions of thermomechanical fatigue SAND-94-0951C DE95 006226 CONF-9503445
Microform規格・テクニカルリポート類
Frear, D. R, Burchett, S. N, Rashid, M. M1994<LS-DE95/006226>
National Diet Library

Effect of travel speed on thermal response in CO2 laser welding of small electronic components SAND-94-3231C DE95 006314 CONF-9508285

Effect of travel speed on thermal response in CO2 laser welding of small electronic components SAND-94-3231C DE95 006314 CONF-9508285
Microform規格・テクニカルリポート類
Gianoulakis, S. E, Burchett, S. N, Fuerschbach, P. W, Knorovsky, G. A1995<LS-DE95/006314>
National Diet Library

Comparison of LBW and GTAW processes in miniature closure welds SAND-95-1149C DE95 015084 CONF-9506822

Comparison of LBW and GTAW processes in miniature closure welds SAND-95-1149C DE95 015084 CONF-9506822
Microform規格・テクニカルリポート類
Knorovsky, G. A, Fuerschbach, P. W, Gianoulakis, S. E, Burchett, S. N1995<LS-DE95/015084>
National Diet Library

STRESS ANALYSIS OF PLATED-THROUGH-HOLES IN RIGID FLEX MULTILAYER PRINTED WIRING BOARDS (SAND ; SAND-92-0271C)

STRESS ANALYSIS OF PLATED-THROUGH-HOLES IN RIGID FLEX MULTILAYER PRINTED WIRING BOARDS (SAND ; SAND-92-0271C)
Paper図書
BURCHETT, S.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1992.
Other Libraries in Japan
  • Author HeadingBURCHETT, S.N.

EXTENSIONS OF "SOME GUIDELINES FOR THE MECHANICAL DESIGN OF COAXIAL COMPRESSION PIN SEALS" (SAND ; SAND-93-0306)

EXTENSIONS OF "SOME GUIDELINES FOR THE MECHANICAL DESIGN OF COAXIAL COMPRESSION PIN SEALS" (SAND ; SAND-93-0306)
Paper図書
CHAMBERS, R.S.// BURCHETT, S.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1993.
Other Libraries in Japan
  • Author HeadingCHAMBERS, R.S. BURCHETT, S.N.

VISCOPLASTIC THEORY FOR BRAZE ALLOYS. (SAND ; SAND-96-0984)

VISCOPLASTIC THEORY FOR BRAZE ALLOYS. (SAND ; SAND-96-0984)
Paper図書
NEILSEN, M.K.// BURCHETT, S.N.// STONE, C.M.// STEPHENS, J.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES)).Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingNEILSEN, M.K. BURCHETT, S.N. STONE, C.M. STEPHENS, J.J.

MICROSTRUCTURALLY BASED MODEL OF SOLDER JOINTS UNDER CONDITIONS OF THERMOMECHANICAL FATIGUE (SAND ; SAND-94-0951C)

MICROSTRUCTURALLY BASED MODEL OF SOLDER JOINTS UNDER CONDITIONS OF THERMOMECHANICAL FATIGUE (SAND ; SAND-94-0951C)
Paper図書
FREAR, D.R.// BURCHETT, S.N.// RASHID, M.M. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingFREAR, D.R. BURCHETT, S.N. RASHID, M.M.

MICROSTRUCTURALLY BASED FINITE ELEMENT SIMULATION OF SOLDER JOINT BEHAVIOR (SAND ; SAND-96-0056C)

MICROSTRUCTURALLY BASED FINITE ELEMENT SIMULATION OF SOLDER JOINT BEHAVIOR (SAND ; SAND-96-0056C)
Paper図書
FREAR, D.R.// BURCHETT, S.N.// NEILSEN, M.K.// STEPHENS, J.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingFREAR, D.R. BURCHETT, S.N. NEILSEN, M.K. STEPHENS, J.J...
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