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Nondestructive inspection assessment of eddy current and electrochemical analysis to separate inconel and stainless steel alloys SAND-98-0319 DE98 004154

Nondestructive inspection assessment of eddy current and electrochemical analysis to separate inconel and stainless steel alloys SAND-98-0319 DE98 004154
Microform規格・テクニカルリポート類
Moore, D. G, Sorensen, N. R1998<LS-DE98/004154>
National Diet Library

Statistical modeling of corrosion-induced wirebond failure SAND-97-0518C DE97 004209 CONF-9703328

Statistical modeling of corrosion-induced wirebond failure SAND-97-0518C DE97 004209 CONF-9703328
Microform規格・テクニカルリポート類
Sorensen, N. R, Braithwaite, J. W1997<LS-DE97/004209>
National Diet Library

Materials and corrosion characterization using the confocal resonator SAND-97-0259 DE97 006210

Materials and corrosion characterization using the confocal resonator SAND-97-0259 DE97 006210
Microform規格・テクニカルリポート類
Tigges, C. P, Sorensen, N. R, Hietala, V. M, Plut, T. A1997<LS-DE97/006210>
National Diet Library

Use of organic solderability preservatives on solderability retention of copper after accelerated aging SAND-96-2286C DE97 002524 CONF-9703551

Use of organic solderability preservatives on solderability retention of copper after accelerated aging SAND-96-2286C DE97 002524 CONF-9703551
Microform規格・テクニカルリポート類
Hernandez, C. L, Sorensen, N. R, Lucero, S. J1997<LS-DE97/002524>
National Diet Library

Moisture and aging effects of solder wettability of copper surfaces SAND-96-2191C DE97 000889 CONF-96101431

Moisture and aging effects of solder wettability of copper surfaces SAND-96-2191C DE97 000889 CONF-96101431
Microform規格・テクニカルリポート類
Hernandez, C. L, Sorensen, N. R, Lucero, S. J1996<LS-DE97/000889>
National Diet Library

Aging, stressing and solderability of electroplated and electroless copper SAND-94-1451 DE95 017638

Aging, stressing and solderability of electroplated and electroless copper SAND-94-1451 DE95 017638
Microform規格・テクニカルリポート類
Sorensen, N. R, Hosking, F. M1995<LS-DE95/017638>
National Diet Library

Electrochemical behavior of Ti and Ti alloys subjected to pulsed ion beam surface treatment SAND-96-1660C DE96 012029 CONF-9610409

Electrochemical behavior of Ti and Ti alloys subjected to pulsed ion beam surface treatment SAND-96-1660C DE96 012029 CONF-9610409
Microform規格・テクニカルリポート類
Sorensen, N. R, Buchheit, R. G, Renk, T. R, Grabowski, K. S, Thompson, M. O1996<LS-DE96/012029>
National Diet Library

NDI using mm-wave resonant techniques SAND-95-1651C DE95 016100 CONF-95113516

NDI using mm-wave resonant techniques SAND-95-1651C DE95 016100 CONF-95113516
Microform規格・テクニカルリポート類
Martens, J. S, Sachtjen, S, Sorensen, N. R1995<LS-DE95/016100>
National Diet Library

Solderability preservation through the use of organic inhibitors SAND-94-2749C DE95 003633 CONF-9503444

Solderability preservation through the use of organic inhibitors SAND-94-2749C DE95 003633 CONF-9503444
Microform規格・テクニカルリポート類
Sorensen, N. R, Hosking, F. M1994<LS-DE95/003633>
National Diet Library

Corrosion resistance of candidate transportation container materials SAND-95-0208C DE96 003658 CONF-95120324

Corrosion resistance of candidate transportation container materials SAND-95-0208C DE96 003658 CONF-95120324
Microform規格・テクニカルリポート類
Maestas, L. M, Sorensen, N. R, McAllaster, M. E1995<LS-DE96/003658>
National Diet Library

Inspection of chemically roughened copper surfaces using optical interferometry and scanning electron microscopy: Establishing a correlation between surface morphology and solderability SAND-95-1752C DE95 016403 CONF-95071602

Inspection of chemically roughened copper surfaces using optical interferometry and scanning electron microscopy: Establishing a correlation between surface morphology and solderability SAND-95-1752C DE95 016403 CONF-95071602
Microform規格・テクニカルリポート類
Stevenson, J. O, Hosking, F. M, Guilinger, T. R, Yost, F. G, Sorensen, N. R1995<LS-DE95/016403>
National Diet Library

Solderability enhancement of copper through chemical etching SAND-95-0734C DE95 010514 CONF-95041421

Solderability enhancement of copper through chemical etching SAND-95-0734C DE95 010514 CONF-95041421
Microform規格・テクニカルリポート類
Stevenson, J. O, Guilinger, T. R, Hosking, F. M, Yost, F. G, Sorensen, N. R1995<LS-DE95/010514>
National Diet Library

NCMS PWB program report surface finishes team task WBS No. 3.1.1: Phase 1, Etching Studies: Chemical etching of copper for improved solderability SAND-95-1241 DE95 015056

NCMS PWB program report surface finishes team task WBS No. 3.1.1: Phase 1, Etching Studies: Chemical etching of copper for improved solderability SAND-95-1241 DE95 015056
Microform規格・テクニカルリポート類
Stevenson, J. O, Guilinger, T. R, Hosking, F. M, Yost, F. G, Sorensen, N. R1995<LS-DE95/015056>
National Diet Library

ELECTROCHEMICAL BEHAVIOR OF TI AND TI ALLEYS SUBFECTED TO PULSED ION (SAND ; SAND-96-1660C)

ELECTROCHEMICAL BEHAVIOR OF TI AND TI ALLEYS SUBFECTED TO PULSED ION (SAND ; SAND-96-1660C)
Paper図書
SORENSEN,N.R. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES).)Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan

AGING, STRESSING AND SOLDERABILITY OF ELECTROPLATED AND ELECTROLESS COPPER (SAND ; SAND-94-1451)

AGING, STRESSING AND SOLDERABILITY OF ELECTROPLATED AND ELECTROLESS COPPER (SAND ; SAND-94-1451)
Paper図書
SORENSEN, N.R.// HOSKING, F.M. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingSORENSEN, N.R. HOSKING, F.M.

NDI USING MM-WAVE RESONANT TECHNIQUES (SAND ; SAND-95-1651C)

NDI USING MM-WAVE RESONANT TECHNIQUES (SAND ; SAND-95-1651C)
Paper図書
MARTENS, J.S.// SACHTJEN, S.// SORENSEN, N.R. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingMARTENS, J.S. SACHTJEN, S. SORENSEN, N.R.

SOLDERABILITY PRESERVATION THROUGH THE USE OF ORGANIC INHIBITORS (SAND ; SAND-94-2749C)

SOLDERABILITY PRESERVATION THROUGH THE USE OF ORGANIC INHIBITORS (SAND ; SAND-94-2749C)
Paper図書
SORENSEN, N.R.// HOSKING, F.M. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingSORENSEN, N.R. HOSKING, F.M.

CORROSION RESISTANCE OF CANDIDATE TRANSPORTATION CONTAINER MATERIALS (SAND ; SAND-95-0208C)

CORROSION RESISTANCE OF CANDIDATE TRANSPORTATION CONTAINER MATERIALS (SAND ; SAND-95-0208C)
Paper図書
MAESTAS, L.M.// SORENSEN, N.R.// MCALLASTER, M.E. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingMAESTAS, L.M. SORENSEN, N.R. MCALLASTER, M.E.

SOLDERABILITY ENHANCEMENT OF COPPER THROUGH CHEMICAL ETCHING (SAND ; SAND-95-0734C)

SOLDERABILITY ENHANCEMENT OF COPPER THROUGH CHEMICAL ETCHING (SAND ; SAND-95-0734C)
Paper図書
STEVENSON, J.O.// GUILINGER, T.R.// HOSKING, F.M.// YOST, F.G.// SORENSEN, N.R. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingSTEVENSON, J.O. GUILINGER, T.R. HOSKING, F.M. YOST, F.G. SORENSEN, N.R.

NCMS PWB PROGRAM REPORT SURFACE FINISHES TEAM TASK WBS NO. 3.1.1: PHASE 1, ETCHING STUDIES: CHEMICAL ETCHING OF COPPER FOR IMPROVED SOLDERABILITY (SAND ; SAND-95-1241)

NCMS PWB PROGRAM REPORT SURFACE FINISHES TEAM TASK WBS NO. 3.1.1: PHASE 1, ETCHING STUDIES: CHEMICAL ETCHING OF COPPER FOR IMPROVED SOLDERABILITY (SAND ; SAND-95-1241)
Paper図書
STEVENSON, J.O.// GUILINGER, T.R.// HOSKING, F.M.// YOST, F.G.// SORENSEN, N.R. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingSTEVENSON, J.O. GUILINGER, T.R. HOSKING, F.M. YOST, F.G. SORENSEN, N.R.
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