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Encyclopedia of packaging materials, processes, and mechanics. Set 1 Interconnect and wafer bonding technology

Encyclopedia of packaging materials, processes, and mechanics. Set 1 Interconnect and wafer bonding technology
Paper図書
editor-in-chief Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay.World Scientific Publishing Co. Pte. Ltd.[2020]<NB141-D1>
National Diet Library
  • Author HeadingBar-Cohen, Avram, 1946- Suhling, J. C. (Jeffrey C.) Tay, Andrew A. O.

Proceedings of the ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS -- 2011 -- : presented at ASME 2011 Pacific Rim technical conference and exhigition [i.e. exhibition] on packaging and integration of electronic and photonic systems, MEMS and NEMS : July 6-8, 2011 : Portland, Oregon, USA : AME 2011 InterPACK conference : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : ASME 2011 Pacific Rim technical conference & exposition on packaging and integration of electronic and photonic systems : InterPACK2011 : Jul 2011, Portland, OR.

Proceedings of the ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS -- 2011 -- : presented at ASME 2011 Pacific Rim technical conference and exhigition [i.e. exhibition] on packaging and integration of electronic and photonic systems, MEMS and NEMS : July 6-8, 2011 : Portland, Oregon, USA : AME 2011 InterPACK conference : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : ASME 2011 Pacific Rim technical conference & exposition on packaging and integration of electronic and photonic systems : InterPACK2011 : Jul 2011, Portland, OR.
Paper図書
ASMEc2012.<M17-12-3833>
National Diet Library
  • Author Heading...Portland, Or.) Suhling, J. C. (Jeffrey C.) Ishizuka, Masaru. Tonapi, San...

Proceedings of the ASME InterPack conference -- 2009 -- : presented at 2009 ASME InterPack conference : July 19-23, 2009 : San Francisco, California USA. : 2009 ASME summer conferences : Jul 2009, San Francisco, CA.

Proceedings of the ASME InterPack conference -- 2009 -- : presented at 2009 ASME InterPack conference : July 19-23, 2009 : San Francisco, California USA. : 2009 ASME summer conferences : Jul 2009, San Francisco, CA.
Paper図書
ASMEc2010.<M17-10-2749>
National Diet Library
  • Author Heading...sfer Division. Suhling, J. C. (Jeffrey C.) Ishizuka, Masaru. Tonapi, San...

IPACK2007 : proceedings of the ASME InterPACK conference -- 2007 -- : presented at 2007 ASME InterPACK conference : July 8-12, 2007 : Vancouver, BC Canada. : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : Jul 2007, Vancouver, Canada.

IPACK2007 : proceedings of the ASME InterPACK conference -- 2007 -- : presented at 2007 ASME InterPACK conference : July 8-12, 2007 : Vancouver, BC Canada. : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : Jul 2007, Vancouver, Canada.
Paper図書
ASMEc2007.<M17-08-687>
National Diet Library
  • Author HeadingSchmidt, Roger. Miura, Hideo. Suhling, J. C. (Jeffrey C.) ASME/Pacific Rim Technical Co...

Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. LiuAmerican Society of Mechanical Engineersc1997
Other Libraries in Japan
  • Author HeadingSuhling, J. C. (Jeffrey C.) Liechti, K. M. Liu, S. (Sheng...

Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. SuhlingAmerican Society of Mechanical Engineersc1995
Other Libraries in Japan
  • Author HeadingSuhling, J. C. (Jeffrey C.) International Mechanical Engi...

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