Jump to main content

yr 〜
yr

Search results 13

Handbook of 3D integration. Volume 4 Design, test, and thermal management

Handbook of 3D integration. Volume 4 Design, test, and thermal management
Paper図書
edited by Paul D. Franzon, Erik Jan Marinissen, and Muhannad S. Bakir.Wiley-VCH[2019]<ND386-B43>
National Diet Library
  • LCCTK7874.893

3D integration in VLSI circuits : implementation technologies and applications (Devices, circuits, and systems)

3D integration in VLSI circuits : implementation technologies and applications (Devices, circuits, and systems)
Paper図書
edited by Katsuyuki Sakuma, managing editor Krzysztof Iniewski.CRC Press/Taylor & Francis Group[2018]<ND386-B40>
National Diet Library
  • LCCTK7874.893

2016 IEEE international 3D systems integration conference : (3DIC 2016) : San Francisco, California, USA : 8-11 November 2016 : Nov 2016, San Francisco, CA.

2016 IEEE international 3D systems integration conference : (3DIC 2016) : San Francisco, California, USA : 8-11 November 2016 : Nov 2016, San Francisco, CA.
Paper図書
IEEE[2016]<M17-19-328>
National Diet Library
  • LCCTK7874.893

2016 international symposium on 3D power electronics integration and manufacturing : (3D-PEIM 2016) : Raleigh, North Carolina, USA : 13-15 June 2016 : 1st international symposium on 3D power electronics integration & manufacturing : 3D PEIM symposium : int'l symp on 3D power electronics integration & mfg : 3D-PEIM conference 2016 : Jun 2016, Raleigh, NC.

2016 international symposium on 3D power electronics integration and manufacturing : (3D-PEIM 2016) : Raleigh, North Carolina, USA : 13-15 June 2016 : 1st international symposium on 3D power electronics integration & manufacturing : 3D PEIM symposium : int'l symp on 3D power electronics integration & mfg : 3D-PEIM conference 2016 : Jun 2016, Raleigh, NC.
Paper図書
IEEE[2016]<M17-17-2587>
National Diet Library
  • LCCTK7874.893

Three-dimensional integration of semiconductors : processing, materials, and applications

Three-dimensional integration of semiconductors : processing, materials, and applications
Paper図書
Kazuo Kondo, Morihiro Kada, Kenji Takahashi, editors.Springer[2015]<ND371-B102>
National Diet Library
  • LCCTK7874.893

2014 international 3D systems integration conference : (3DIC 2014) : Kinsdale, Ireland : 1-3 December 2014 : Dec 2014, Kinsale, Ireland.

2014 international 3D systems integration conference : (3DIC 2014) : Kinsdale, Ireland : 1-3 December 2014 : Dec 2014, Kinsale, Ireland.
Paper図書
IEEE[2014]<M17-16-715>
National Diet Library
  • LCCTK7874.893

Stress induced phenomena and reliability in 3D microelectronics : Kyoto, Japan : 28-30 May 2012 : international workshops "stress management for 3D ICs using through silicon vias--design for reliability" : 12th international workshop on stress-induced phenomena in microelectronics : May 2012, Kyoto, Japan. (AIP Conference Proceedings ; 1601)

Stress induced phenomena and reliability in 3D microelectronics : Kyoto, Japan : 28-30 May 2012 : international workshops "stress management for 3D ICs using through silicon vias--design for reliability" : 12th international workshop on stress-induced phenomena in microelectronics : May 2012, Kyoto, Japan. (AIP Conference Proceedings ; 1601)
Paper図書
American Institute of Physics2014.<M17-15-831>
National Diet Library
  • LCCTK7874.893

Handbook of 3D integration. Volume 1 and 2 Technology and applications of 3D integrated circuits

Handbook of 3D integration. Volume 1 and 2 Technology and applications of 3D integrated circuits
Paper図書
edited by Philip Garrou, Christopher Bower, and Peter Ramm.Wiley-VCH Verlag GmbH & Co. KGaA[2012]<ND386-B41>
National Diet Library
  • LCCTK7874.893

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Paper図書
Er-Ping Li.Wileyc2012.<ND386-B26>
National Diet Library
  • LCCTK7874.893

Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------. (AIP Conference Proceedings ; 1378)

Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------. (AIP Conference Proceedings ; 1378)
Paper図書
American Institute of Physics2011.<M17-12-2241>
National Diet Library
  • LCCTK7874.893

3D IC integration and packaging

3D IC integration and packaging
Paper図書
John H. LauMcGraw-Hill Educationc2016
Other Libraries in Japan
  • LCCTK7874.893

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC : hardback

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC : hardback
Paper図書
Er-Ping LiIEEE Pressc2012
Other Libraries in Japan
  • LCCTK7874.893

3D IC stacking technology : hardback

3D IC stacking technology : hardback
Paper図書
Banqiu Wu, Ajay Kumar, Sesh RamaswamiMcGraw-Hillc2011
Other Libraries in Japan
  • LCCTK7874.893

Reached to the end of result.

RSS