yr 〜
yr

Search results 316

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.
Paper図書
The American Society of Mechanical Engineers[2020]<M17-20-1371>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.
Paper図書
The American Society of Mechanical Engineers[2019]<M17-20-1069>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging. IPACK2018

Polymeric materials for electronic packaging

Polymeric materials for electronic packaging
Paper図書
Shozo NakamuraIEEE Press[2023]<ND92-D4>
National Diet LibraryOther Libraries in Japan

Nano-bio-electronic, photonic and MEMS packaging Second edition

Nano-bio-electronic, photonic and MEMS packaging Second edition
Paper図書
C.P. (Ching-Ping) Wong, Kyoung-sik (Jack) Moon, editorsSpringer[2021]<M213-D125>
National Diet Library

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.
Paper図書
The American Society of Mechanical Engineers[2017]<M17-19-909>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

2016 17th international conference on electronic packaging technology : (ICEPT 2016) : Wuhan, China : 16-19 August 2016 : Aug 2016, Wuhan, China.

2016 17th international conference on electronic packaging technology : (ICEPT 2016) : Wuhan, China : 16-19 August 2016 : Aug 2016, Wuhan, China.
Paper図書
IEEE[2016]<M17-18-429>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

2016 international conference on electronics packaging : (ICEP 2016) : Hokkaido, Japan : 20-22 April 2016 : ICEP2016 : Apr 2016, Sapporo, Japan.

2016 international conference on electronics packaging : (ICEP 2016) : Hokkaido, Japan : 20-22 April 2016 : ICEP2016 : Apr 2016, Sapporo, Japan.
Paper図書
IEEE[2016]<M17-17-2333>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

2016 IEEE 18th electronics packaging technology conference (EPTC 2016) : Singapore : 30 November-3 December 2016 : Nov 2016, Singapore.

2016 IEEE 18th electronics packaging technology conference (EPTC 2016) : Singapore : 30 November-3 December 2016 : Nov 2016, Singapore.
Paper図書
IEEE[2016]<M17-19-118>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

Electronic enclosures, housings and packages (Woodhead Publishing series in electronic and optical materials)

Electronic enclosures, housings and packages (Woodhead Publishing series in electronic and optical materials)
Paper図書
Dr Frank Süli.Woodhead Publishing[2019]<ND351-B94>
National Diet Library
  • Subject HeadingElectronic packaging. TECHNOLOGY & ENGINEERING / Me...

2015 IEEE 17th electronics packaging and technology conference (EPTC 2015) : Singapore : 2-4 December 2015 : Dec 2015, Singapore.

2015 IEEE 17th electronics packaging and technology conference (EPTC 2015) : Singapore : 2-4 December 2015 : Dec 2015, Singapore.
Paper図書
IEEE[2015]<M17-17-760>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.
Paper図書
The American Society of Mechanical Engineers[2015]<M17-16-1112>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

2015 international conference on electronics packaging and iMAPS all Asia conference : (ICEP-IACC 2015) : Kyoto, Japan : 14-17 April 2015 : ICEP-IAAC2015 : joint conference of ICEP (the international conference on electronics packaging) and IAAC (IMAPS all Asia conference) : 4th IAAC : Apr 2015, Kyoto, Japan.

2015 international conference on electronics packaging and iMAPS all Asia conference : (ICEP-IACC 2015) : Kyoto, Japan : 14-17 April 2015 : ICEP-IAAC2015 : joint conference of ICEP (the international conference on electronics packaging) and IAAC (IMAPS all Asia conference) : 4th IAAC : Apr 2015, Kyoto, Japan.
Paper図書
IEEE[2015]<M17-17-762>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

2015 16th international conference on electronic packaging technology : (ICEPT 2015) : Changsha, China : 11-14 August 2015 : Aug 2015, Changsha, China.

2015 16th international conference on electronic packaging technology : (ICEPT 2015) : Changsha, China : 11-14 August 2015 : Aug 2015, Changsha, China.
Paper図書
IEEE[2015]<M17-17-755>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

2014 15th international conference on electronic packaging technology : (ICEPT 2014) : Cehngdu, China : 12-15 August 2014 : 2014电子封装技术国际会议 : Aug 2014, Chengdu, China.

2014 15th international conference on electronic packaging technology : (ICEPT 2014) : Cehngdu, China : 12-15 August 2014 : 2014电子封装技术国际会议 : Aug 2014, Chengdu, China.
Paper図書
IEEE[2014]<M17-16-1342>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

2014 international conference on electronics packaging : (ICEP 2014) : Toyama, Japan : 23-25 April 2014 : ICEP2014 conference : Apr 2014, Toyama, Japan.

2014 international conference on electronics packaging : (ICEP 2014) : Toyama, Japan : 23-25 April 2014 : ICEP2014 conference : Apr 2014, Toyama, Japan.
Paper図書
IEEE[2014]<M17-15-1741>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2013-- : presented at ASME 2013 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 16-18, 2013 : Burlingame, Califronia, USA : InterPACK 2013 : Jul 2013, Burlingame, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2013-- : presented at ASME 2013 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 16-18, 2013 : Burlingame, Califronia, USA : InterPACK 2013 : Jul 2013, Burlingame, CA.
Paper図書
ASME[2014]<M17-14-2930>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

2014 IEEE 16th electronics packaging technology conference : (EPTC 2014) : Singapore : 3-5 December 2014 : Dec 2014, Singapore. CFP14453-ART

2014 IEEE 16th electronics packaging technology conference : (EPTC 2014) : Singapore : 3-5 December 2014 : Dec 2014, Singapore. CFP14453-ART
Paper図書
IEEE[2014]<M17-16-1348>
National Diet Library
  • Subject HeadingElectronic packaging--Congresses. Electronic packaging.

Encyclopedia of thermal packaging : a guide to cooling of electeronic equipment. Set 3 Thermal packaging applications

Encyclopedia of thermal packaging : a guide to cooling of electeronic equipment. Set 3 Thermal packaging applications
Paper図書
editor-in-chief, Avram Bar-Cohen.World Scientific Publishing Co. Pte. Ltd.[2019]<ND351-B96>
National Diet Library
  • Subject HeadingElectronic packaging. Electronic apparatus and appl...

2015 European microelectronics packaging conference : (EMPC 2015) : Friedrichshafen, Germany : 14-16 September 2015 : 20th European microelectronics and packaging conference & exhibition : Sep 2015, Friedrichshafen, Germany.

2015 European microelectronics packaging conference : (EMPC 2015) : Friedrichshafen, Germany : 14-16 September 2015 : 20th European microelectronics and packaging conference & exhibition : Sep 2015, Friedrichshafen, Germany.
Paper図書
IEEE[2015]<M17-17-1368>
National Diet Library
  • Subject Heading...s--Congresses. Electronic packaging. Microelectronics.

Encyclopedia of thermal packaging : a guide to cooling of electronic equipment. Set 2 Thermal packaging tools

Encyclopedia of thermal packaging : a guide to cooling of electronic equipment. Set 2 Thermal packaging tools
Paper図書
editor-in-chief, Avram Bar-Cohen.World Scientific[2015]<ND351-B64>
National Diet Library
  • Subject HeadingElectronic packaging. Insulation (Heat)