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Bonding theory for metals and alloys Second edition.

Bonding theory for metals and alloys Second edition.
紙図書
Frederick E. Wang.Elsevier[2019]<PA217-B6>
国立国会図書館
  • 件名Chemical bonds. Metal bonding. Alloys.

Bonding theory for metals and alloys / Frederick E. Wang. 1st ed.

Bonding theory for metals and alloys / Frederick E. Wang. 1st ed.
紙図書
Elsevier2005.<PA217-B1>
国立国会図書館
  • 件名Chemical bonds. Metal bonding. Alloys. Liaisons chimique...

Microjoining and nanojoining / edited by Y. Zhou. (Woodhead Publishing in materials)

Microjoining and nanojoining / edited by Y. Zhou. (Woodhead Publishing in materials)
紙図書
Woodhead Pub.2008.<ND416-B23>
国立国会図書館
  • 内容細目...rochu. Ceramic/metal bonding / A Wu.
  • 件名...g (Technology) Metal bonding. Microelectronics. Nanoele...

Stress induced phenomena and reliability in 3D microelectronics : Kyoto, Japan : 28-30 May 2012 : international workshops "stress management for 3D ICs using through silicon vias--design for reliability" : 12th international workshop on stress-induced phenomena in microelectronics : May 2012, Kyoto, Japan. (AIP Conference Proceedings ; 1601)

Stress induced phenomena and reliability in 3D microelectronics : Kyoto, Japan : 28-30 May 2012 : international workshops "stress management for 3D ICs using through silicon vias--design for reliability" : 12th international workshop on stress-induced phenomena in microelectronics : May 2012, Kyoto, Japan. (AIP Conference Proceedings ; 1601)
紙図書
American Institute of Physics2014.<M17-15-831>
国立国会図書館
  • 件名...gresses. Metal-metal bonds--Congresses. Strength of mat...

Stress-induced phenomena in metallization : eleventh international workshop on stress-induced phenomena in metallization : Bad Schandau, Germany 12-14 April 2010. : Apr 2010, Bad Schandau, Germany. (AIP Conference Proceedings ; 1300)

Stress-induced phenomena in metallization : eleventh international workshop on stress-induced phenomena in metallization : Bad Schandau, Germany 12-14 April 2010. : Apr 2010, Bad Schandau, Germany. (AIP Conference Proceedings ; 1300)
紙図書
American Institute of Physics2010.<M17-11-1386>
国立国会図書館
  • 件名...gresses. Metal-metal bonds -- Congresses. Strength of m...

Fundamentals of metal joining : processes, mechanism and performance hbk.

Fundamentals of metal joining : processes, mechanism and performance hbk.
紙図書
Dheerendra Kumar DwivediSpringer2022
全国の図書館
  • 件名Metal bonding
  • 件名（識別子）Metal bonding

Stress-induced phenomena in metallization : tenth international workshop on stress-induced phenomena in metallization : Austin, Texas 5-7 November 2008. : 10th stress workshop : Nov 2008, Austin, TX. (AIP Conference Proceedings ; 1143)

Stress-induced phenomena in metallization : tenth international workshop on stress-induced phenomena in metallization : Austin, Texas 5-7 November 2008. : 10th stress workshop : Nov 2008, Austin, TX. (AIP Conference Proceedings ; 1143)
紙図書
American Institute of Physics2009.<M17-10-405>
国立国会図書館全国の図書館
  • 件名...gresses. Metal-metal bonds -- Congresses. Strength of m...

Stress-induced phenomena in metallization : ninth international workshop on stress-induced phenomena in metallization : Kyoto, Japan 4-6 April 2007. : Apr 2007, Kyoto, Japan. (AIP Conference Proceedings ; 945)

Stress-induced phenomena in metallization : ninth international workshop on stress-induced phenomena in metallization : Kyoto, Japan 4-6 April 2007. : Apr 2007, Kyoto, Japan. (AIP Conference Proceedings ; 945)
紙図書
American Institute of Physics2007.<M17-08-188>
国立国会図書館
  • 件名...gresses. Metal-metal bonds -- Congresses. Strength of m...

Explosive spot joining of metals [microform] / inventors, Laurence J. Bement, Ronnie B. Perry (NASA case ; no. LAR 15264-1)

Explosive spot joining of metals [microform] / inventors, Laurence J. Bement, Ronnie B. Perry (NASA case ; no. LAR 15264-1)
マイクロ図書
1996<YCA-NAS 1.71:LAR-15264-1>
国立国会図書館
  • 件名Metal-metal bonding Metal joints Wire Splicing...

Bonding theory for metals and alloys 2nd ed

Bonding theory for metals and alloys 2nd ed
紙図書
Frederick E. WangElsevierc2019
全国の図書館
  • 件名Metal bonding Alloys
  • 件名（識別子）Metal bonding Alloys

Stress-induced phenomena in metallization : eighth international workshop on stress-induced phenomena in metallization : Dresden, Germany 12-14 September 2005. : Sep 2005, Dresden, Germany. (AIP Conference Proceedings ; 817)

Stress-induced phenomena in metallization : eighth international workshop on stress-induced phenomena in metallization : Dresden, Germany 12-14 September 2005. : Sep 2005, Dresden, Germany. (AIP Conference Proceedings ; 817)
紙図書
American Institute of Physics2006.<M17-06-1138>
国立国会図書館
  • 件名...gresses. Metal-metal bonds -- Congresses. Strength of m...

Rhenium mechanical properties and joining technology [microform] / Brian D. Reed and James A. Biaglow (NASA technical memorandum ; 107317)

Rhenium mechanical properties and joining technology [microform] / Brian D. Reed and James A. Biaglow (NASA technical memorandum ; 107317)
マイクロ図書
1996<YCA-NAS 1.15:107317>
国立国会図書館
  • 件名Rhenium Mechanical properties Shear strength Tensile strength Metal joints Metal bonding

Evaluation of rhenium joining methods [microform] / Brian D. Reed and Sybil H. Morren (NASA technical memorandum ; 107055)

Evaluation of rhenium joining methods [microform] / Brian D. Reed and Sybil H. Morren (NASA technical memorandum ; 107055)
マイクロ図書
1995<YCA-NAS 1.15:107055>
国立国会図書館
  • 件名...Intermetallics Metal bonding Rhenium

Materials research for high speed civil transport and generic hypersonics [microform] : metals durability / Paul Schulz and Daniel Hoffman (NASA contractor report ; 198326)

Materials research for high speed civil transport and generic hypersonics [microform] : metals durability / Paul Schulz and Daniel Hoffman (NASA contractor report ; 198326)
マイクロ図書
1996<YCA-NAS 1.26:198326>
国立国会図書館
  • 件名...nic transports Metal bonding Fatigue (Materials) Fractu...

Physics and chemistry of metal cluster compounds : model systems for small metal particles / edited by L.J. de Jongh. (Physics and chemistry of materials with low-dimensional structures ; v. 18)

Physics and chemistry of metal cluster compounds : model systems for small metal particles / edited by L.J. de Jongh. (Physics and chemistry of materials with low-dimensional structures ; v. 18)
紙図書
Kluwer Academic Publishersc1994.<PA47-A68>
国立国会図書館
  • 件名金属クラスター化合物. Metal crystals. Metal-metal bonds.

Molecular metal-metal bonds : compounds, synthesis, properties : print

Molecular metal-metal bonds : compounds, synthesis, properties : print
紙図書
edited by Stephen T. LiddleWiley-VCHc2015
全国の図書館
  • 件名Metal-metal bonds
  • 件名（識別子）Metal-metal bonds

Preparation, characterisation and reactivity of low oxidation state d-block metal complexes stabilised by extremely bulky amide ligands

Preparation, characterisation and reactivity of low oxidation state d-block metal complexes stabilised by extremely bulky amide ligands
紙図書
Jamie HicksSpringerc2017
全国の図書館
  • 件名Transition metal compounds Metal-metal bonds Organometallic compounds
  • 件名（識別子）Transition metal compounds Metal-metal bonds Organometallic compounds

Metal and alloy bonding : an experimental analysis : charge density in metals and alloys

Metal and alloy bonding : an experimental analysis : charge density in metals and alloys
紙図書
R. Saravanan, M. Prema RaniSpringerc2012
全国の図書館
  • 件名Metal bonding Charge density waves
  • 件名（識別子）Metal bonding Charge density waves

Final report to National Aeronautics and Space Administration, NASA Lewis Research Center for ceramic-to-metal bonding for pressure transducers microform / principal investigator, John D. Mackenzie (NASA-CR ; 173500)

Final report to National Aeronautics and Space Administration, NASA Lewis Research Center for ceramic-to-metal bonding for pressure transducers microform / principal investigator, John D. Mackenzie (NASA-CR ; 173500)
マイクロ図書
1984<YCA-NAS 1.26:173500>
国立国会図書館
  • 件名Ceramic to metal bonding Diffusion bonding (Metals)

Microjoining and nanojoining : Woodhead

Microjoining and nanojoining : Woodhead
紙図書
Edited by Y. ZhouWoodhead2008
全国の図書館
  • 件名Metal bonding Sealing (Technology) Micro...
  • 件名（識別子）Metal bonding Sealing (Technology) Micro...