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Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.
紙図書
The American Society of Mechanical Engineers[2020]<M17-20-1371>
国立国会図書館

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.
紙図書
The American Society of Mechanical Engineers[2019]<M17-20-1069>
国立国会図書館

2015 IEEE international workshop on integrated power packaging (IWIPP 2015) : Chicago, Illinois, USA : 3-6 May 2015 : IWIPP conference : May 2015, Chicago, IL.

2015 IEEE international workshop on integrated power packaging (IWIPP 2015) : Chicago, Illinois, USA : 3-6 May 2015 : IWIPP conference : May 2015, Chicago, IL.
紙図書
IEEE[2015]<M17-17-1154>
国立国会図書館

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.
紙図書
The American Society of Mechanical Engineers[2017]<M17-19-909>
国立国会図書館

2016 17th international conference on electronic packaging technology : (ICEPT 2016) : Wuhan, China : 16-19 August 2016 : Aug 2016, Wuhan, China.

2016 17th international conference on electronic packaging technology : (ICEPT 2016) : Wuhan, China : 16-19 August 2016 : Aug 2016, Wuhan, China.
紙図書
IEEE[2016]<M17-18-429>
国立国会図書館

2016 international conference on electronics packaging : (ICEP 2016) : Hokkaido, Japan : 20-22 April 2016 : ICEP2016 : Apr 2016, Sapporo, Japan.

2016 international conference on electronics packaging : (ICEP 2016) : Hokkaido, Japan : 20-22 April 2016 : ICEP2016 : Apr 2016, Sapporo, Japan.
紙図書
IEEE[2016]<M17-17-2333>
国立国会図書館

2016 IEEE 18th electronics packaging technology conference (EPTC 2016) : Singapore : 30 November-3 December 2016 : Nov 2016, Singapore.

2016 IEEE 18th electronics packaging technology conference (EPTC 2016) : Singapore : 30 November-3 December 2016 : Nov 2016, Singapore.
紙図書
IEEE[2016]<M17-19-118>
国立国会図書館

2012 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2012) : Taipei, Taiwan : 9-11 December 2012 : Dec 2012, Taipei, Taiwan.

2012 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2012) : Taipei, Taiwan : 9-11 December 2012 : Dec 2012, Taipei, Taiwan.
紙図書
IEEEc2012.<M17-13-3175>
国立国会図書館

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.
紙図書
The American Society of Mechanical Engineers[2015]<M17-16-1112>
国立国会図書館

2015 IEEE 17th electronics packaging and technology conference (EPTC 2015) : Singapore : 2-4 December 2015 : Dec 2015, Singapore.

2015 IEEE 17th electronics packaging and technology conference (EPTC 2015) : Singapore : 2-4 December 2015 : Dec 2015, Singapore.
紙図書
IEEE[2015]<M17-17-760>
国立国会図書館

2012 13th international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2012) : Guilin, Guangxi, China : 13-16 August 2012 : Aug 2012, Guilin, China. CFP12553

2012 13th international conference on electronic packaging technology & high density packaging : (ICEPT-HDP 2012) : Guilin, Guangxi, China : 13-16 August 2012 : Aug 2012, Guilin, China. CFP12553
紙図書
IEEEc2012.<M17-13-3145>
国立国会図書館

2015 international conference on electronics packaging and iMAPS all Asia conference : (ICEP-IACC 2015) : Kyoto, Japan : 14-17 April 2015 : ICEP-IAAC2015 : joint conference of ICEP (the international conference on electronics packaging) and IAAC (IMAPS all Asia conference) : 4th IAAC : Apr 2015, Kyoto, Japan.

2015 international conference on electronics packaging and iMAPS all Asia conference : (ICEP-IACC 2015) : Kyoto, Japan : 14-17 April 2015 : ICEP-IAAC2015 : joint conference of ICEP (the international conference on electronics packaging) and IAAC (IMAPS all Asia conference) : 4th IAAC : Apr 2015, Kyoto, Japan.
紙図書
IEEE[2015]<M17-17-762>
国立国会図書館

2013 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2013) : Nara, Japan : 12-15 December 2013 : EDAPS2013 : Dec 2013, Nara, Japan.

2013 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2013) : Nara, Japan : 12-15 December 2013 : EDAPS2013 : Dec 2013, Nara, Japan.
紙図書
IEEE[2013]<M17-15-2606>
国立国会図書館

2015 16th international conference on electronic packaging technology : (ICEPT 2015) : Changsha, China : 11-14 August 2015 : Aug 2015, Changsha, China.

2015 16th international conference on electronic packaging technology : (ICEPT 2015) : Changsha, China : 11-14 August 2015 : Aug 2015, Changsha, China.
紙図書
IEEE[2015]<M17-17-755>
国立国会図書館

2011 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2011) : Hanzhou, China : 12-14 December 2011 : Dec 2011, Hanzhou, China.

2011 IEEE electrical design of advanced packaging and systems symposium : (EDAPS 2011) : Hanzhou, China : 12-14 December 2011 : Dec 2011, Hanzhou, China.
紙図書
IEEEc2011.<M17-13-146>
国立国会図書館

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2013-- : presented at ASME 2013 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 16-18, 2013 : Burlingame, Califronia, USA : InterPACK 2013 : Jul 2013, Burlingame, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2013-- : presented at ASME 2013 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 16-18, 2013 : Burlingame, Califronia, USA : InterPACK 2013 : Jul 2013, Burlingame, CA.
紙図書
ASME[2014]<M17-14-2930>
国立国会図書館

2014 15th international conference on electronic packaging technology : (ICEPT 2014) : Cehngdu, China : 12-15 August 2014 : 2014电子封装技术国际会议 : Aug 2014, Chengdu, China.

2014 15th international conference on electronic packaging technology : (ICEPT 2014) : Cehngdu, China : 12-15 August 2014 : 2014电子封装技术国际会议 : Aug 2014, Chengdu, China.
紙図書
IEEE[2014]<M17-16-1342>
国立国会図書館

2013 14th international conference on electronic packaging technology : (ICEPT 2013) : Dalian, China : 11-14 August 2013 : Aug 2013, Dalian, China.

2013 14th international conference on electronic packaging technology : (ICEPT 2013) : Dalian, China : 11-14 August 2013 : Aug 2013, Dalian, China.
紙図書
IEEE[2013]<M17-14-2904>
国立国会図書館

2014 IEEE 16th electronics packaging technology conference : (EPTC 2014) : Singapore : 3-5 December 2014 : Dec 2014, Singapore. CFP14453-ART

2014 IEEE 16th electronics packaging technology conference : (EPTC 2014) : Singapore : 3-5 December 2014 : Dec 2014, Singapore. CFP14453-ART
紙図書
IEEE[2014]<M17-16-1348>
国立国会図書館

2014 international conference on electronics packaging : (ICEP 2014) : Toyama, Japan : 23-25 April 2014 : ICEP2014 conference : Apr 2014, Toyama, Japan.

2014 international conference on electronics packaging : (ICEP 2014) : Toyama, Japan : 23-25 April 2014 : ICEP2014 conference : Apr 2014, Toyama, Japan.
紙図書
IEEE[2014]<M17-15-1741>
国立国会図書館
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