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2016 international symposium on 3D power electronics integration and manufacturing : (3D-PEIM 2016) : Raleigh, North Carolina, USA : 13-15 June 2016 : 1st international symposium on 3D power electronics integration & manufacturing : 3D PEIM symposium : int'l symp on 3D power electronics integration & mfg : 3D-PEIM conference 2016 : Jun 2016, Raleigh, NC.

2016 international symposium on 3D power electronics integration and manufacturing : (3D-PEIM 2016) : Raleigh, North Carolina, USA : 13-15 June 2016 : 1st international symposium on 3D power electronics integration & manufacturing : 3D PEIM symposium : int'l symp on 3D power electronics integration & mfg : 3D-PEIM conference 2016 : Jun 2016, Raleigh, NC.
Paper図書
IEEE[2016]<M17-17-2587>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Congresses. P......r electronics. Three-dimensional integrated circuits.

Wireless interface technologies for 3D IC and module integration

Wireless interface technologies for 3D IC and module integration
Paper図書
Tadahiro Kuroda, Wai-Yeung YipCambridge University Press2021<ND351-D27>
National Diet Library
  • Subject Heading...it technology) Three-dimensional integrated circuits Optical interconnects TECHNOL...

3D integration in VLSI circuits : implementation technologies and applications (Devices, circuits, and systems)

3D integration in VLSI circuits : implementation technologies and applications (Devices, circuits, and systems)
Paper図書
edited by Katsuyuki Sakuma, managing editor Krzysztof Iniewski.CRC Press/Taylor & Francis Group[2018]<ND386-B40>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits. Integrated circuits--Very la...

2016 IEEE 66th electronic components and technology conference (ECTC 2016) : Las Vegas, Nevada, USA : 31 May-3 June 2016 : May 2016, Las Vegas, NV.

2016 IEEE 66th electronic components and technology conference (ECTC 2016) : Las Vegas, Nevada, USA : 31 May-3 June 2016 : May 2016, Las Vegas, NV.
Paper図書
IEEE[2016]<M17-18-428>
National Diet Library
  • Subject Heading...s--Congresses. Three-dimensional integrated circuits--Congresses. S......emiconductors. Three-dimensional integrated circuits.

2016 IEEE international 3D systems integration conference : (3DIC 2016) : San Francisco, California, USA : 8-11 November 2016 : Nov 2016, San Francisco, CA.

2016 IEEE international 3D systems integration conference : (3DIC 2016) : San Francisco, California, USA : 8-11 November 2016 : Nov 2016, San Francisco, CA.
Paper図書
IEEE[2016]<M17-19-328>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Congresses. I......ional imaging. Three-dimensional integrated circuits.

2015 international 3D systems integration conference : (3DIC 2015) : Sendai, Japan : 31 August-2 September 2015 : IEEE 2015 international 3D systems integration conference : Aug 2015, Sendai, Japan.

2015 international 3D systems integration conference : (3DIC 2015) : Sendai, Japan : 31 August-2 September 2015 : IEEE 2015 international 3D systems integration conference : Aug 2015, Sendai, Japan.
Paper図書
IEEE[2015]<M17-17-55>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Congresses. I......ional imaging. Three-dimensional integrated circuits.

Handbook of 3D integration. Volume 4 Design, test, and thermal management

Handbook of 3D integration. Volume 4 Design, test, and thermal management
Paper図書
edited by Paul D. Franzon, Erik Jan Marinissen, and Muhannad S. Bakir.Wiley-VCH[2019]<ND386-B43>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Design and construction--Han...

2014 international 3D systems integration conference : (3DIC 2014) : Kinsdale, Ireland : 1-3 December 2014 : Dec 2014, Kinsale, Ireland.

2014 international 3D systems integration conference : (3DIC 2014) : Kinsdale, Ireland : 1-3 December 2014 : Dec 2014, Kinsale, Ireland.
Paper図書
IEEE[2014]<M17-16-715>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Congresses. I......ional imaging. Three-dimensional integrated circuits.

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Paper図書
Er-Ping Li.Wileyc2012.<ND386-B26>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits. TECHNOLOGY & ENGINEERING / E...

2013 IEEE international 3D systems integration conference : (3DIC 2013) : San Francisco, California, USA : 2-4 October 2013 : Oct 2013, San Francisco, CA.

2013 IEEE international 3D systems integration conference : (3DIC 2013) : San Francisco, California, USA : 2-4 October 2013 : Oct 2013, San Francisco, CA.
Paper図書
IEEE[2013]<M17-15-61>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Congresses. I......ional imaging. Three-dimensional integrated circuits.

2014 4th IEEE international workshop on low temperature bonding for 3D integration : (LTB-3D 2014) : Tokyo, Japan : 15-16 July 2014 : LTB-3D conference : Jul 2014, Tokyo, Japan.

2014 4th IEEE international workshop on low temperature bonding for 3D integration : (LTB-3D 2014) : Tokyo, Japan : 15-16 July 2014 : LTB-3D conference : Jul 2014, Tokyo, Japan.
Paper図書
IEEE[2014]<M17-15-2107>
National Diet Library
  • Subject Heading...)--Congresses. Three-dimensional integrated circuits--Congresses. Photonics--Mater...

2013 IEEE 63rd electronic components and technology conference : (ECTC 2013) : Las Vegas, Nevada, USA : 28-31 May 2013 : ECTC professional development courses : May 2013, Las Vegas, NV.

2013 IEEE 63rd electronic components and technology conference : (ECTC 2013) : Las Vegas, Nevada, USA : 28-31 May 2013 : ECTC professional development courses : May 2013, Las Vegas, NV.
Paper図書
IEEEc2013.<M17-14-1053>
National Diet Library
  • Subject Heading...s--Congresses. Three-dimensional integrated circuits--Congresses. Semiconductors--...

2011 IEEE international 3D systems integration conference : (3DIC 2011) : Osaka, Japan : 31 January-2 February 2012 : (postponed from October 2011) : 2011 IEEE international 3D system integration conference : Jan 2012, Osaka, Japan.

2011 IEEE international 3D systems integration conference : (3DIC 2011) : Osaka, Japan : 31 January-2 February 2012 : (postponed from October 2011) : 2011 IEEE international 3D system integration conference : Jan 2012, Osaka, Japan.
Paper図書
IEEEc2012.<M17-13-889>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Congresses. Integrated circu...

2016 17th international symposium on quality electronic design (ISQED 2016) : Santa Clara, California, USA : 15-16 March 2016 : ISQED 2016 conference : 17th int'l symposium on quality electronic design : Mar 2016, Santa Clara, CA.

2016 17th international symposium on quality electronic design (ISQED 2016) : Santa Clara, California, USA : 15-16 March 2016 : ISQED 2016 conference : 17th int'l symposium on quality electronic design : Mar 2016, Santa Clara, CA.
Paper図書
IEEE[2016]<M17-17-2496>
National Diet Library
  • Subject Heading...n--Congresses. Three-dimensional integrated circuits--Congresses. I...... construction. Three-dimensional integrated circuits.

2015 16th international symposium on quality electronic design : (ISQED 2015) : Santa Clara, California, USA : 2-4 March 2015 : 16th int'l symposium on quality electronic design : ISQED 2015 conference : Mar 2015, Santa Clara, CA.

2015 16th international symposium on quality electronic design : (ISQED 2015) : Santa Clara, California, USA : 2-4 March 2015 : 16th int'l symposium on quality electronic design : ISQED 2015 conference : Mar 2015, Santa Clara, CA.
Paper図書
IEEE[2015]<M17-17-1652>
National Diet Library
  • Subject Heading...n--Congresses. Three-dimensional integrated circuits--Congresses. I...... construction. Three-dimensional integrated circuits.

2014 15th international symposium on quality electronic design : (ISQED 2014) : Santa Clara, California, USA : 3-5 March 2014 : 15th int'l symposium on quality electronic design : ISQED 2014 conference : ISQED tutorials : ISQED events : Mar 2014, Santa Clara, CA.

2014 15th international symposium on quality electronic design : (ISQED 2014) : Santa Clara, California, USA : 3-5 March 2014 : 15th int'l symposium on quality electronic design : ISQED 2014 conference : ISQED tutorials : ISQED events : Mar 2014, Santa Clara, CA.
Paper図書
IEEE[2014]<M17-15-2495>
National Diet Library
  • Subject Heading...n--Congresses. Three-dimensional integrated circuits--Congresses. I...... construction. Three-dimensional integrated circuits.

Stress induced phenomena and reliability in 3D microelectronics : Kyoto, Japan : 28-30 May 2012 : international workshops "stress management for 3D ICs using through silicon vias--design for reliability" : 12th international workshop on stress-induced phenomena in microelectronics : May 2012, Kyoto, Japan. (AIP Conference Proceedings ; 1601)

Stress induced phenomena and reliability in 3D microelectronics : Kyoto, Japan : 28-30 May 2012 : international workshops "stress management for 3D ICs using through silicon vias--design for reliability" : 12th international workshop on stress-induced phenomena in microelectronics : May 2012, Kyoto, Japan. (AIP Conference Proceedings ; 1601)
Paper図書
American Institute of Physics2014.<M17-15-831>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Congresses. Interconnects (I...

Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------. (AIP Conference Proceedings ; 1378)

Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------. (AIP Conference Proceedings ; 1378)
Paper図書
American Institute of Physics2011.<M17-12-2241>
National Diet Library
  • Subject HeadingThree-dimensional integrated circuits--Design and construction--Con...

International symposium on quality electronic design : (ISQED 2013) : Santa Clara, California, USA : 4-6 March 2013 : ISQED 2013 conference : 14th international symposium on quality electronic design : Mar 2013, Santa Clara, CA.

International symposium on quality electronic design : (ISQED 2013) : Santa Clara, California, USA : 4-6 March 2013 : ISQED 2013 conference : 14th international symposium on quality electronic design : Mar 2013, Santa Clara, CA.
Paper図書
IEEEc2013.<M17-14-459>
National Diet Library
  • Subject Heading...n--Congresses. Three-dimensional integrated circuits--Congresses. Integrated circu...

3D IC integration and packaging

3D IC integration and packaging
Paper図書
John H. LauMcGraw-Hill Educationc2016
Other Libraries in Japan
  • Subject HeadingThree-dimensional integrated circuits Microelectronic packaging
  • Subject Heading (ID)Three-dimensional integrated circuits Microelectronic packaging
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