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APPLICATION OF NON-CYANIDE GOLD FOR SELECTIVE PLATING OF MICROELECTRONIC CIRCUITS (SAND ; SAND-91-0342C)

APPLICATION OF NON-CYANIDE GOLD FOR SELECTIVE PLATING OF MICROELECTRONIC CIRCUITS (SAND ; SAND-91-0342C)
Paper図書
WOROBEY, W.// RIEGER, D. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (USA))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingWOROBEY, W. RIEGER, D.

GOLD SULFIDE REPLACEMENTS OF CYANIDE SOLUTIONS (SAND ; SAND-91-1509C)

GOLD SULFIDE REPLACEMENTS OF CYANIDE SOLUTIONS (SAND ; SAND-91-1509C)
Paper図書
WOROBEY, W.// NORWOOD, D.// RIEGER, D. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingWOROBEY, W. NORWOOD, D. RIEGER, D.

ECR, ICP, and RIE plasma etching of GaN SAND-96-1139C DE96 010562 CONF-96050213

ECR, ICP, and RIE plasma etching of GaN SAND-96-1139C DE96 010562 CONF-96050213
Microform規格・テクニカルリポート類
Shul, R. J, McClellan, G. B, Rieger, D. J, Hafich, M. J1996<LS-DE96/010562>
National Diet Library

Plasma chemistry dependent ECR etching of GaN SAND-95-2737C DE96 003701 CONF-95115520

Plasma chemistry dependent ECR etching of GaN SAND-95-2737C DE96 003701 CONF-95115520
Microform規格・テクニカルリポート類
Shul, R. J, Ashby, C. I. H, Rieger, D. J1995<LS-DE96/003701>
National Diet Library

ECR etching of GaP, GaAs, InP, and InGaAs in Cl(sub 2)/Ar, Cl(sub 2)/N(sub 2), BCl(sub 3)/Ar, and BCl(sub 3)/N(sub 2) SAND-96-1143C DE96 010521 CONF-96040139

ECR etching of GaP, GaAs, InP, and InGaAs in Cl(sub 2)/Ar, Cl(sub 2)/N(sub 2), BCl(sub 3)/Ar, and BCl(sub 3)/N(sub 2) SAND-96-1143C DE96 010521 CONF-96040139
Microform規格・テクニカルリポート類
Shul, R. J, Baca, A. G, Rieger, D. J, Hou, H, Pearton, S. J1996<LS-DE96/010521>
National Diet Library

Role of AlN encapsulation of GaN during implant activation annealing SAND-96-2021C DE96 014841 CONF-9610406

Role of AlN encapsulation of GaN during implant activation annealing SAND-96-2021C DE96 014841 CONF-9610406
Microform規格・テクニカルリポート類
Zolper, J. C, Rieger, D. J, Baca, A. G, Pearton, S. J, Lee, J. W1996<LS-DE96/014841>
National Diet Library

Dry etch development of W/WSi short Gate MESFETs SAND-96-0076C DE96 004704 SAND-96-0781C CONF-9605022

Dry etch development of W/WSi short Gate MESFETs SAND-96-0076C DE96 004704 SAND-96-0781C CONF-9605022
Microform規格・テクニカルリポート類
Shul, R. J, Sherwin, M. E, Baca, A. G, Zolper, J. C, Rieger, D. J1996<LS-DE96/004704>
National Diet Library

Metallization and packaging of compound semiconductor devices at Sandia National Laboratories SAND-96-1415C DE96 013183 CONF-96101911

Metallization and packaging of compound semiconductor devices at Sandia National Laboratories SAND-96-1415C DE96 013183 CONF-96101911
Microform規格・テクニカルリポート類
Seigal, P. K, Armendariz, M. G, Rieger, D. J, Lear, K. L, Sullivan, C. T1996<LS-DE96/013183>
National Diet Library

Adhesion studies of GaAs-based ohmic contact and bond pad metallization SAND-95-2117C DE96 008229 CONF-9604571

Adhesion studies of GaAs-based ohmic contact and bond pad metallization SAND-95-2117C DE96 008229 CONF-9604571
Microform規格・テクニカルリポート類
Seigal, P. K, Briggs, R. D, Rieger, D. J, Baca, A. G, Howard, A. J1996<LS-DE96/008229>
National Diet Library

GaAs integrated circuit process characterization and non-destructive process monitoring by atomic force microscopy SAND-95-1108C DE95 013033 CONF-9505185

GaAs integrated circuit process characterization and non-destructive process monitoring by atomic force microscopy SAND-95-1108C DE95 013033 CONF-9505185
Microform規格・テクニカルリポート類
Baca, A. G, Howard, A. J, Shul, R. J, Zolper, J. C, Rieger, D. J1995<LS-DE95/013033>
National Diet Library

Plasma-induced-damage of GaAs during etching of refractory metal contacts SAND-94-1318C DE95 001525 CONF-9410011

Plasma-induced-damage of GaAs during etching of refractory metal contacts SAND-94-1318C DE95 001525 CONF-9410011
Microform規格・テクニカルリポート類
Shul, R. J, Lovejoy, M. L, Baca, A. G, Zolper, J. C, Rieger, D. J1994<LS-DE95/001525>
National Diet Library

Spectroscopic, morphological, and electrical characterization of PdGe ohmic contacts to n-GaAs SAND-94-2201C DE95 000738 CONF-94111321

Spectroscopic, morphological, and electrical characterization of PdGe ohmic contacts to n-GaAs SAND-94-2201C DE95 000738 CONF-94111321
Microform規格・テクニカルリポート類
Howard, A. J, Lovejoy, M. L, Zavadil, K. R, Rieger, D. J, Shul, R. J1994<LS-DE95/000738>
National Diet Library

Using electrochemistry in device processing on poly(tetrafluoroethylene) substrates SAND-94-1172C DE95 000541 CONF-9410636

Using electrochemistry in device processing on poly(tetrafluoroethylene) substrates SAND-94-1172C DE95 000541 CONF-9410636
Microform規格・テクニカルリポート類
Howard, A. J, Rye, R. R, Ricco, A. J, Rieger, D. J, Lovejoy, M. L1994<LS-DE95/000541>
National Diet Library

Low resistivity ohmic contacts to moderately doped n-GaAs with low temperature processing SAND-94-1367C DE95 008507 CONF-94100114

Low resistivity ohmic contacts to moderately doped n-GaAs with low temperature processing SAND-94-1367C DE95 008507 CONF-94100114
Microform規格・テクニカルリポート類
Lovejoy, M. L, Howard, A. J, Zavadil, K. R, Rieger, D. J, Shul, R. J1994<LS-DE95/008507>
National Diet Library

ECR, ICP, AND RIE PLASMA ETCHING OF GAN (SAND ; SAND-96-1139C)

ECR, ICP, AND RIE PLASMA ETCHING OF GAN (SAND ; SAND-96-1139C)
Paper図書
SHUL, R.J.// MCCLELLAN, G.B.// RIEGER, D.J.// HAFICH, M.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingSHUL, R.J. MCCLELLAN, G.B. RIEGER, D.J. HAFICH, M.J.

PLASMA CHEMISTRY DEPENDENT ECR ETCHING OF GAN (SAND ; SAND-95-2737C)

PLASMA CHEMISTRY DEPENDENT ECR ETCHING OF GAN (SAND ; SAND-95-2737C)
Paper図書
SHUL, R.J.// ASHBY, C.I.H.// RIEGER, D.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingSHUL, R.J. ASHBY, C.I.H. RIEGER, D.J.

ADHESION STUDIES OF GAAS-BASED OHMIC CONTACT AND BOND PAD METALLIZATION (SAND ; SAND-95-2117C)

ADHESION STUDIES OF GAAS-BASED OHMIC CONTACT AND BOND PAD METALLIZATION (SAND ; SAND-95-2117C)
Paper図書
SEIGAL, P.K.// BRIGGS, R.D.// RIEGER, D.J.// BACA, A.G.// HOWARD, A.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingSEIGAL, P.K. BRIGGS, R.D. RIEGER, D.J. BACA, A.G. HOWARD, A.J.

DRY ETCH DEVELOPMENT OF W/WSI SHORT GATE MESFETS (SAND ; SAND-96-0076C)

DRY ETCH DEVELOPMENT OF W/WSI SHORT GATE MESFETS (SAND ; SAND-96-0076C)
Paper図書
SHUL, R.J.// SHERWIN, M.E.// BACA, A.G.// ZOLPER, J.C.// RIEGER, D.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingSHUL, R.J. SHERWIN, M.E. BACA, A.G. ZOLPER, J.C. RIEGER, D.J.

ECR ETCHING OF GAP, GAAS, INP, AND INGAAS IN CL/SUB 2//AR, CL/SUB 2//N/SUB 2/, BCL/SUB 3// AR, AND BCL/SUB 3//N/SUB 2/ (SAND ; SAND-96-1143C)

ECR ETCHING OF GAP, GAAS, INP, AND INGAAS IN CL/SUB 2//AR, CL/SUB 2//N/SUB 2/, BCL/SUB 3// AR, AND BCL/SUB 3//N/SUB 2/ (SAND ; SAND-96-1143C)
Paper図書
SHUL, R.J.// BACA, A.G.// RIEGER, D.J.// HOU, H.// PEARTON, S.J.// REN, F. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingSHUL, R.J. BACA, A.G. RIEGER, D.J. HOU, H. PEARTON, S.J. REN, ...

CRITICAL ANALYSIS OF VIA HOLE ETCHING WITH A MANUFACTURABLE RIE PROCESS USING SICL/SUB 4//BCL/SUB 3//CL/SUB 2/ CHEMISTRIES (SAND ; SAND-93-2637C)

CRITICAL ANALYSIS OF VIA HOLE ETCHING WITH A MANUFACTURABLE RIE PROCESS USING SICL/SUB 4//BCL/SUB 3//CL/SUB 2/ CHEMISTRIES (SAND ; SAND-93-2637C)
Paper図書
LOVEJOY, M.L.// SHUL, R.J.// RIEGER, D.J.// CONSTANTINE, C. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1993.
Other Libraries in Japan
  • Author HeadingLOVEJOY, M.L. SHUL, R.J. RIEGER, D.J. CONSTANTINE, C.
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