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Semiconductor Packaging

Semiconductor Packaging
Digital電子書籍・電子雑誌図書
CRC Press2011
Available onlineNational Diet Library

Theoretical study of adhesive interfaces between epoxy resin and metal surface in semiconductor packages

Theoretical study of adhesive interfaces between epoxy resin and metal surface in semiconductor packages
Digital博士論文障害者向け資料あり
鶴見, 直明鶴見, 直明2021
National Diet Library

Wide bandgap power semiconductor packaging : materials, components, and reliability (Woodhead Publishing series in electronic and optical materials)

Wide bandgap power semiconductor packaging : materials, components, and reliability (Woodhead Publishing series in electronic and optical materials)
Paper図書
edited by Katsuaki Suganuma.Woodhead Publishing, an imprint of Elsevier[2018]<ND371-B123>
National Diet Library
  • Summary, etc."Wide Bandgap Power Semiconductor Packaging: Materials, Co...... bandgap power semiconductor packaging at various levels, including ...

Semiconductor packaging : materials interaction and reliability

Semiconductor packaging : materials interaction and reliability
Paper図書
Andrea Chen, Randy Hsiao-Yu Lo.CRC Pressc2012.<ND351-B49>
National Diet Library

Semiconductor packaging symposium : Jul 1998, San Jose, CA.

Semiconductor packaging symposium : Jul 1998, San Jose, CA.
Paper図書
SEMI1998.<M17-99-1842>
National Diet Library
  • Note (General)...8. Index term: semiconductor packaging ; SEMICON West ; SEMI. BL she...
  • Alternative TitleHeld as part of SEMICON West 98 semiconductor packaging ; SEMICON West ; SEMI
  • Alternative TitleHeld as part of SEMICON West 98 semiconductor packaging ; SEMICON West ; SEMI

3rd annual semiconductor packaging symposium in cooperation with the surface mount technology association : July 11-12, 2000, San Jose Hilton and Towers, San Jose, California. : Jul 2000, San Jose, CA.

3rd annual semiconductor packaging symposium in cooperation with the surface mount technology association : July 11-12, 2000, San Jose Hilton and Towers, San Jose, California. : Jul 2000, San Jose, CA.
Paper図書
SEMIc2000.<M17-03-1032>
National Diet Library
  • Alternative Titlesemi : 3rd annual semiconductor packaging symposium : SEMICON West 2000...
  • Alternative Titlesemi : 3rd annual semiconductor packaging symposium : SEMICON West 2000...

The effect of imports of ceramic semiconductor packages on the national security [microform] : an investigation conducted under section 232 of the Trade Expansion Act of 1962, as amended

The effect of imports of ceramic semiconductor packages on the national security [microform] : an investigation conducted under section 232 of the Trade Expansion Act of 1962, as amended
Microform図書
1993<YCA-C 63.2:IM 7/4>
National Diet Library

半導体パッケージビジネス戦略 2022 (LSIデータベース)

半導体パッケージビジネス戦略 2022 (LSIデータベース)
Paper図書
グローバルネット2022.3<DL475-R35>
National Diet Library

半導体パッケージハンドブック 2017-2018

半導体パッケージハンドブック 2017-2018
Paper図書
産業タイムズ社2017.7<DL475-L395>
National Diet LibraryOther Libraries in Japan

半導体実装装置の高精度化・高速化に関する研究

半導体実装装置の高精度化・高速化に関する研究
Paper博士論文
瀨山耕平 [著][2019]<UT51-2020-A70>
National Diet Library
  • Alternative TitleA study on accuracy and speed improvement of semiconductor packaging equipment
  • Alternative TitleA study on accuracy and speed improvement of semiconductor packaging equipment

半導体パッケージ用封止材料の開発と応用

半導体パッケージ用封止材料の開発と応用
Paper博士論文
宝藏寺裕之 [著][宝藏寺裕之][2010]<UT51-2010-K310>
National Diet Library

特殊半導体パッケージ(BGA)用絶縁部材のための新規高性能エポキシ樹脂の開発研究

特殊半導体パッケージ(BGA)用絶縁部材のための新規高性能エポキシ樹脂の開発研究
Paper博士論文
小椋一郎 [著][小椋一郎][2010]<UT51-2011-K414>
National Diet Library

Wide bandgap power semiconductor packaging : materials, components, and reliability : print

Wide bandgap power semiconductor packaging : materials, components, and reliability : print
Paper図書
edited by Katsuaki SuganumaWoodhead Publishing, an imprint of Elsevierc2018
Other Libraries in Japan

高密度実装半導体パッケージWL-CSPの信頼性評価に関する研究

高密度実装半導体パッケージWL-CSPの信頼性評価に関する研究
Paper博士論文
松崎富夫 [著][松崎富夫][2009]<UT51-2010-K294>
National Diet Library

半導体実装におけるマイクロソルダリング技術に関する研究

半導体実装におけるマイクロソルダリング技術に関する研究
Paper博士論文
中森孝 [著][中森孝]2005<UT51-2006-F861>
National Diet Library
  • Alternative TitleStudy on micro soldering technology in semiconductor packaging
  • Alternative TitleStudy on micro soldering technology in semiconductor packaging

電子部品マイクロ接合部の非破壊評価法と接合状態の定量化に関する研究

電子部品マイクロ接合部の非破壊評価法と接合状態の定量化に関する研究
Paper博士論文
上野一也 [著][上野一也][2007]<UT51-2008-A348>
National Diet Library

Semiconductor packaging 2nd ed.

Semiconductor packaging 2nd ed.
Paper図書
edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. KlopfensteinChapman & Hallc1997
Other Libraries in Japan

Semiconductor packaging : materials interaction and reliability : hardback

Semiconductor packaging : materials interaction and reliability : hardback
Paper図書
Andrea Chen, Randy Hsiao-Yu LoCRC Pressc2012
Other Libraries in Japan

Future Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate

Future Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate
Paper文書・図像類
江尻, 芳則, Ejiri, Yoshinori宇宙航空研究開発機構研究開発本部電子部品・デバイス・材料グループ(JAXA)2012-11-01p.1-30
Other Libraries in Japan

Finite element analysis of nonlinear deformation mechanisms in semiconductor packages

Finite element analysis of nonlinear deformation mechanisms in semiconductor packages
Paper図書
by Ali Osman AyhanUMI Dissertation Services1999
Other Libraries in Japan
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